1,3-异苯并呋喃二酮,(苯基乙炔基)- | 174629-79-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并呋喃
• 中文名称: 1,3-异苯并呋喃二酮,(苯基乙炔基)-
• 英文名称: 4-(Phenylethynyl)-2-benzofuran-1,3-dione
• 英文别名: 4-(2-phenylethynyl)-2-benzofuran-1,3-dione
• CAS: 174629-79-9
• 化学式: C₁₆H₈O₃
• 分子量: 248.23
• InChiKey: AXMANIZPMQZKTG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  19
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  43.4
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Space environmentally durable polyimides and copolyimides
  申请人：——

  公开号：US20030045670A1

  公开（公告）日：2003-03-06

  Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transistion (T g ) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents. Controlled molecular weight oligomeric (amide acid)s and imides can be prepared by offsetting the stoichiometry according to the Carothers equation using excess diamine and endcapping with aromatic anhydrides The polyimide materials can be processed into various material forms such as thin films, fibers, foams, threads, adhesive film, coatings, dry powders, and fiber coated prepreg, and uses include thin film membranes on antennas, second-surface mirrors, thermal optical coatings, and multi-layer thermal insulation (MLI) blanket materials.

  提供低颜色的聚酰亚胺薄膜，抗原子氧、真空紫外辐射、有机溶剂溶解性的聚酰亚胺，具有高玻璃转变温度（Tg）和高热稳定性。通过在极性非质子溶剂中的芳香族二酐和含有苯基膦氧基团的二胺的摩尔比反应制备聚酰亚胺和共聚酰亚胺。可以通过根据卡罗瑟方程调整摩尔比，使用过量二胺并用芳香族酐进行端基处理，制备控制分子量寡聚物（酰亚胺）和亚酰亚胺。聚酰亚胺材料可加工成各种形式的材料，如薄膜、纤维、泡沫、线、胶粘膜、涂料、干粉和涂覆纤维的预浸料，用途包括天线上的薄膜膜、第二表面镜、热光学涂层和多层热隔热毯材料。
• AROMATIC DIAMINE, AN INTERMEDIATE THEREFOR, A METHOD FOR PRODUCING THE AROMATIC DIAMINE, AND A METHOD FOR PRODUCING THE INTERMEDIATE THEREFOR
  申请人：SEIKA CORPORATION

  公开号：US20180079732A1

  公开（公告）日：2018-03-22

  A novel asymmetric diamine, diamino-2-(benzothiazole-2-yl)diphenyl ether, derivatives therefor, and an intermediate for the compound such as aminonitro-2-(benzothiazole-2-yl)diphenyl ether, dinitro-2-(benzothiazole-2-yl)diphenyl ether, and derivatives from these. Additionally, another novel asymmetric diamine, diamino-2-(benzoxazole-2-yl)diphenyl ether, derivatives therefor, and intermediate for the compound such as aminonitro-2-(benzoxazole-2-yl)diphenyl ether, dinitro-2-(benzoxazole-2-yl)diphenyl ether, and derivatives from these, and methods for preparing them.

  一种新型的不对称二胺，二氨基-2-(苯并噻唑-2-基)二苯醚，以及其衍生物，以及该化合物的中间体，如氨基硝基-2-(苯并噻唑-2-基)二苯醚，二硝基-2-(苯并噻唑-2-基)二苯醚，以及从中得到的衍生物。此外，另一种新型的不对称二胺，二氨基-2-(苯并噁唑-2-基)二苯醚，以及其衍生物，以及该化合物的中间体，如氨基硝基-2-(苯并噁唑-2-基)二苯醚，二硝基-2-(苯并噁唑-2-基)二苯醚，以及从中得到的衍生物，以及其制备方法。
• Phenylethynyl-containing imide silanes
  申请人：——

  公开号：US20030158351A1

  公开（公告）日：2003-08-21

  Phenylethynyl containing imide-silanes were prepared from aminoalkyl and aminoaryl alkoxy silanes and 4-phenyletbynylphthalic anhydride in toluene to form the imide in one step or in N-methyl-2-pyrrolidinone (NMP) to form the amide acid intermediate. Controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were prepared in NMP from aromatic dianhydrides, aromatic diamines, diamines containing pendent phenylethynyl groups and aminoaryl alkoxy silanes. The phenylethynyl containing imide-silanes and controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were used to improve the adhesion between phenylethynyl containing imide adhesives and inorganic substrates (i.e. metal). Hydrolysis of the alkoxy silane moiety formed a silanol functionality which reacted with the metal surface to form a metal-oxygen-silicon (oxane) bond under the appropriate reaction conditions. Upon thermal cure, the phenylethynyl group of the coupling agent reacts with the phenylethynyl functionality of phenylethynyl containing imide adhesives and becomes chemically bonded to the matrix. The resultant adhesive bond is more durable (i.e. hot-wet environmental resistance) than adhesive bonds made without the use of the coupling agent due to covalent bond formation between the phenylethynyl containing imide-silane coupling agent or the controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes and both the metal substrate and phenylethynyl containing imide adhesives.

  苯乙炔基含有咪唑硅烷是通过在甲苯中使用氨基烷基和氨基芳基烷氧基硅烷以及4-苯乙炔基邻苯二甲酸酐一步法制备的咪唑化合物，或者在N-甲基-2-吡咯烷酮（NMP）中制备酰胺酸中间体。使用芳香二酸酐、芳香二胺、含苯乙炔基的二胺和氨基芳基烷氧基硅烷在NMP中制备了分子量可控的苯乙炔基末端的酰胺酸寡聚体。苯乙炔基含有咪唑硅烷和分子量可控的苯乙炔基末端的酰胺酸寡聚体被用来提高苯乙炔基含有咪唑胶粘剂与无机基底（如金属）之间的粘附力。硅烷的烷氧基水解成硅醇官能团，它在适当的反应条件下与金属表面反应形成金属-氧-硅（氧化物）键。在热固化过程中，偶联剂的苯乙炔基与苯乙炔基含有咪唑胶粘剂的苯乙炔基官能团反应，并与基质化学键合。由于苯乙炔基含有咪唑硅烷偶联剂或分子量可控的苯乙炔基末端的酰胺酸寡聚体与金属基底和苯乙炔基含有咪唑胶粘剂之间形成了共价键，所以形成的胶粘剂键更耐久（即具有热湿环境耐受性），比不使用偶联剂制备的胶粘剂键更为耐久。
• Process for producing polyimide
  申请人：——

  公开号：US20030158370A1

  公开（公告）日：2003-08-21

  A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: 1 in formula (1), X represents —CH 2 — or —N(CH 3 )—, and in formula (2), R 1 and R 2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH 3 , —C 2 H 7 , —C 3 H 7 , —C 2 H 9 , —C 5 H 11 , —C 6 H 13 , —C 7 H 15 , —C 8 H 17 , —C 9 H 19 , —C 10 H 21 , —OCH 3 , —O(C 6 H 5 ), —NO 2 , —Cl, —Br and —F.

  本发明的聚酰亚胺的制备过程包括在含有50至100重量％化学式（1）所示的含氮环状化合物和化学式（2）所示的酚的等摩尔组成的溶剂中，使一种二胺和一种四羧酸二酐发生缩酰亚胺反应： 式（1）中，X代表—CH2—或—N（CH3）—，在式（2）中，R1和R2可以相同，也可以不同，分别代表—H，—OH，—CH3，—C2H7，—C3H7，—C2H9，—C5H11，—C6H13，—C7H15，—C8H17，—C9H19，—C10H21，—OCH3，—O（C6H5），—NO2，—Cl，—Br和—F中的任意一种。
• REACTIVE MONOMER AND RESIN COMPOSITION CONTAINING SAME
  申请人：Watanabe Hisashi

  公开号：US20100059261A1

  公开（公告）日：2010-03-11

  A material for use in flexible printed wiring board having high reliability and allowing for processing fine wiring includes a compound represented by the following general formula (I): wherein one of X and Y represents O and the other represents NAr 2 R 2 , and R 1 , R 2 , Ar 1 , and Ar 2 are as defined in the specification, and a resin composition comprising the compound as a reactive monomer.

  用于具有高可靠性和允许加工细小线路的柔性印制线路板的材料包括由以下一般式(I)表示的化合物：其中X和Y中的一个表示O，另一个表示NAr2R2，R1，R2，Ar1和Ar2如规范中所定义，以及包含该化合物作为反应单体的树脂组成物。