The present invention provides an LSI device polishing composition containing water, abrasive grains, an organic acid, and an oxidizing agent, and having a pH of 5.5-10.0 adjusted by an alkaline substance, the LSI device polishing composition being used for polishing a copper-containing metal wiring layer in which copper is deposited on an insulating film via barrier metal formed of Ta or TaN; and a method for producing LSI devices by use of the polishing composition. During polishing of a barrier metal such as Ta or TaN and a copper wiring layer, the rate of polishing Ta or TaN can be enhanced, to thereby prevent dishing and erosion.
本发明提供了一种 LSI 器件抛光组合物,该组合物含有
水、磨粒、有机酸和氧化剂,并通过碱性物质调节 pH 值为 5.5-10.0,该 LSI 器件抛光组合物用于抛光含
铜金属布线层,其中
铜通过由 Ta 或 TaN 形成的阻挡
金属沉积在绝缘膜上;本发明还提供了一种通过使用该抛光组合物生产 LSI 器件的方法。在Ta或TaN等阻挡层
金属和
铜布线层的抛光过程中,可以提高Ta或TaN的抛光速度,从而防止剥离和侵蚀。