Composition(s) and atomic layer deposition (ALD) process(es) for the formation of a silicon oxide containing film at one or more deposition temperature of about 500° C. is disclosed. In one aspect, the composition and process use one or more silicon precursors selected from compounds having the following formulae I, II, described and combinations thereof
R
1
R
2
m
Si(NR
3
R
4
)
n
X
p
; and I.
R
1
R
2
m
Si(OR
3
)
n
(OR
4
)
q
X
p
. II
本发明揭示了用于在约500℃的一个或多个沉积温度下形成含有
硅氧化物薄膜的组合物和原子层沉积(ALD)工艺。在一方面,该组合物和工艺使用以下化合物之一或多个
硅前体,并且它们的组合:R1R2mSi(NR3R4)nXp;和I.R1R2mSi(OR3)n(OR4)qXp。II