HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS
申请人:Air Products and Chemicals, Inc.
公开号:US20130295779A1
公开(公告)日:2013-11-07
Composition(s) and atomic layer deposition (ALD) process(es) for the formation of a silicon oxide containing film at one or more deposition temperature of about 500° C. is disclosed. In one aspect, the composition and process use one or more silicon precursors selected from compounds having the following formulae I, II, described and combinations thereof
R
1
R
2
m
Si(NR
3
R
4
)
n
X
p
; and I.
R
1
R
2
m
Si(OR
3
)
n
(OR
4
)
q
X
p
. II
High temperature atomic layer deposition of silicon oxide thin films
申请人:Air Products and Chemicals, Inc.
公开号:US09460912B2
公开(公告)日:2016-10-04
Composition(s) and atomic layer deposition (ALD) process(es) for the formation of a silicon oxide containing film at one or more deposition temperature of about 500° C. is disclosed. In one aspect, the composition and process use one or more silicon precursors selected from compounds having the following formulae I, II, described and combinations thereof
R1R2mSi(NR3R4)nXp; and I.
R1R2mSi(OR3)n(OR4)qXp. II
公开了一种用于在约500°C的一个或多个沉积温度下形成含有硅氧化物的薄膜的组成和原子层沉积(ALD)过程。 在一个方面,该组成和过程使用一个或多个选自具有以下公式I、II的硅前体化合物以及它们的描述和组合物
R1R2mSi(NR3R4)nXp; 和 I。
R1R2mSi(OR3)n(OR4)qXp。 II