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N',N'''-dimethyl-N,N''-hexanediyl-di-urea | 20633-52-7

中文名称
——
中文别名
——
英文名称
N',N'''-dimethyl-N,N''-hexanediyl-di-urea
英文别名
N',N'''-Dimethyl-N,N''-hexandiyl-di-harnstoff;1-Methyl-3-[6-(methylcarbamoylamino)hexyl]urea
<i>N</i>',<i>N</i>'''-dimethyl-<i>N</i>,<i>N</i>''-hexanediyl-di-urea化学式
CAS
20633-52-7
化学式
C10H22N4O2
mdl
MFCD00088787
分子量
230.31
InChiKey
VDMSBKGOZIHFTK-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    192-195 °C(Solv: N,N-dimethylformamide (68-12-2))
  • 沸点:
    510.8±33.0 °C(Predicted)
  • 密度:
    1.032±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    -0.1
  • 重原子数:
    16
  • 可旋转键数:
    7
  • 环数:
    0.0
  • sp3杂化的碳原子比例:
    0.8
  • 拓扑面积:
    82.3
  • 氢给体数:
    4
  • 氢受体数:
    2

反应信息

  • 作为产物:
    描述:
    N-methyl-1-phenylmethanimine 以75%的产率得到
    参考文献:
    名称:
    IVANOV N. A.; VLASOVA R. V.; GONCHAROVA V. A.; SMIRNOV L. N., IZV. VYSSH. UCHEB. ZAVEDENIJ. XIMIYA I XIM. TEXNOL. , 1976, 19, +
    摘要:
    DOI:
点击查看最新优质反应信息

文献信息

  • Production of urethane compounds
    申请人:Asahi Kasei Kogyo Kabushiki Kaisha
    公开号:EP0083096A2
    公开(公告)日:1983-07-06
    A process for producing a urethane compound which comprises reacting at least one compound selected from the group consisting of a primary amine, a secondary amine and a urea compound with carbon monoxide and an organic hydroxyl compound in the presence of a catalyst system comprising: (a) at least one member selected from the group consisting of platinum group metals and compounds containing at least one platinum group element; and (b) at least one halogen-containing compound selected from the group consisting of alkali or alkaline earth metal halides, onium halides, compounds capable of forming onium halides in the reaction, oxo acids of halogen atoms and their salts, complex compounds containing halogen ions, organic halides and halogen molecules, in the presence of molecular oxygen and/or an organic nitro compound as an oxidizing agent at a temperature of from about 80°C to about 300°C under a pressure of from about 1 Kg/cm2 to about 500 Kg/cm2.
    一种生产聚氨酯化合物的工艺,包括使至少一种选自由伯胺、仲胺和脲化合物组成的组中的化合物与一氧化碳和有机羟基化合物在催化剂体系存在下发生反应,催化剂体系包括 (a) 至少一种选自铂族金属和含有至少一种铂族元素的化合物的成员;以及 (b) 至少一种含卤化合物,该化合物选自由碱金属或碱土金属卤化物、卤化铌、能在反应中 形成卤化铌的化合物、卤素原子的氧酸及其盐、含卤素离子的复合物、有机卤化物和卤素 分子组成的组、 在分子氧和/或作为氧化剂的有机硝基化合物存在下,在约 1 Kg/cm2 至约 500 Kg/cm2 的压力下,温度约为 80°C 至约 300°C。
  • Petersen, Justus Liebigs Annalen der Chemie, 1949, vol. 562, p. 210,220
    作者:Petersen
    DOI:——
    日期:——
  • STRICTLY SEGMENTED THERMOPLASTIC ELASTOMERS AS BIODEGRADABLE BIOMATERIALS
    申请人:Symo-chem B.V.
    公开号:EP3157978B1
    公开(公告)日:2021-08-11
  • CLEANING AGENT FOR SEMICONDUCTOR DEVICE AND CLEANING METHOD USING THE SAME
    申请人:NISHIWAKI Yoshinori
    公开号:US20090088361A1
    公开(公告)日:2009-04-02
    The present invention provides a cleaning agent for cleaning a semiconductor device having copper wiring on the surface thereof following a chemical mechanical polishing process in a production process of a semiconductor device, including a compound represented by the following formula (I): X 1 -L—X 2 formula (I) wherein, in formula (I), X 1 and X 2 each independently represent a monovalent substituent formed by removing one hydrogen atom from a heterocycle containing at least one nitrogen atom, and L represents a divalent linking group; and provides a cleaning method using the cleaning agent.
  • POLISHING LIQUID FOR METAL AND POLISHING METHOD USING THE SAME
    申请人:TOMIGA Takamitsu
    公开号:US20090239380A1
    公开(公告)日:2009-09-24
    A liquid for polishing a metal is provided that is used for chemically and mechanically polishing a conductor film including copper or a copper alloy in production of a semiconductor device, and a polishing method using the metal-polishing liquid is also provided. The liquid includes: (a) colloidal silica particles having an average primary particle size of from 10 nm to 25 nm and an average secondary particle size of from 50 nm to 70 nm; (b) a metal anticorrosive agent; (c) at least one compound selected from the group consisting of a surfactant and a water-soluble polymer compound; (d) an oxidizing agent; and (e) an organic acid.
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