The present invention relates to a specific process for preparing organosilane esters of the formula (I) and a composition comprising more than 98% by weight of organosilane esters of the formula (I) and less than 2.0% by weight of at least one hydrocarbon and to the use of such a composition as precursor for producing a layer or film having a dielectric constant of 1 < κ ≤ 4.
本发明涉及一种特定的制备式(I)有机
硅酯的过程,以及一种组成物,其由式(I)有机
硅酯的重量占98%以上,至少一种碳氢化合物的重量占不到2.0%,并且将此类组成物用作产生介电常数为1 < κ ≤ 4的层或膜的前体的用途。