3,3'-(p-phenylenedioxy)diphthalic anhydride | 52257-41-7

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并呋喃
• 英文名称: 3,3'-(p-phenylenedioxy)diphthalic anhydride
• 英文别名: 4,4'-[1,4-Phenylenebis(oxy)]di(2-benzofuran-1,3-dione)；4-[4-[(1,3-dioxo-2-benzofuran-4-yl)oxy]phenoxy]-2-benzofuran-1,3-dione
• CAS: 52257-41-7
• 化学式: C₂₂H₁₀O₈
• 分子量: 402.317
• InChiKey: AFDHKKWBKRJYSV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.7
• 重原子数：
  30
• 可旋转键数：
  4
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  105
• 氢给体数：
  0
• 氢受体数：
  8

反应信息

• 作为产物：
  描述：

  反应 10.0h， 以90%的产率得到3,3'-(p-phenylenedioxy)diphthalic anhydride
  参考文献：
  名称：

  一种芳香族二醚二酐的制备方法

  摘要：

  本发明公开了一种芳香族二醚二酐的制备方法，利用异丁烯或者叔丁醇作为氯代或硝基邻苯二甲酸的羧基的保护基，在与双酚二钠盐发生醚化反应后，获得的中间体中的叔丁酯保护基无需强碱处理，用少量酸处理即可脱除，获得二醚四酸，最后，固体四酸在合适的温度下直接成酐，无需用醋酐脱水，而且整个过程的反应时间只需21小时左右。本发明的芳香族二醚二酐的制备方法反应周期短，工艺简单、安全，生产效率高，生产成本低。

  公开号：

  CN112321550B

文献信息

• Process for the production of silicones
  申请人：M & T CHEMICALS, INC.

  公开号：EP0014599A2

  公开（公告）日：1980-08-20

  Novel silicones having the general formula wherein 0 is an aromatic nucleus, Z is-S- or-0-, R is a bivalent group or a functional bivalent group, each R' is chosen from monovalent hydrocarbon radicals and functional hydrocarbon radicals and any one R' may be the same as or different from another R1, R3 is hydrogen or a hydrocarbon radical or a functional group or atom, x is 0 or an integer of 1 or more, F is a functional group or atom, with the proviso that F is not primary amino when Z is other than -0-, and T is a group chosen from alkoxy, aryloxy or other substituted or unsubstituted oxyhydrocarbyl radical and a group having the general formula wherein Q, Z, R, R1, R3 and F are as defined above and any one R may be the same as or different from the other R and one R3 may be different from the other R3. These compounds may be made by reacting the compound with or with where G denotes alkoxy or aryloxy or other substituted or unsubstituted oxyhydrocarbyl radical under conditions set out in the specification. The compounds are suitable for making copolymers of silicones with other organic chemicals, curing catalys for epoxies, urethane and the like.

  通式如下的新型有机硅 其中 0 是芳香族核，Z 是-S- 或-0-，R 是二价基团或官能二价基团，每个 R'选自单价烃基和官能烃基，任何一个 R'可以与另一个 R1 相同或不同，R3 是氢或烃基或官能团或原子、x 是 0 或 1 或 1 以上的整数，F 是官能团或原子，但当 Z 不是-0-时，F 不是伯氨基，T 是选自烷氧基、芳氧基或其他取代或未取代的氧基烃基和具有通式的基团。 其中 Q、Z、R、R1、R3 和 F 如上定义，任何一个 R 可以与另一个 R 相同或不同，一个 R3 可以与另一个 R3 不同。 这些化合物可通过以下反应制得 与 或 其中 G 表示烷氧基或芳氧基或其它取代或未取代的氧代烃基，反应条件见说明书。 这些化合物适用于制造有机硅与其他有机化学品的共聚物、环氧树脂的固化催化剂、聚氨酯等。
• Copolymeric coating compositions
  申请人：M & T CHEMICALS, INC.

  公开号：EP0015720A1

  公开（公告）日：1980-09-17

  A coating composition comprising a curable copolymer material which is the product of a condensation reaction, preferably a condensation reaction of corresponding molar quantities of an organic diamine and a silicone containing a bis-amino aryl ether or bis-amino aryl thioether and an organic dianhydride in at least one organic solvent chosen from monoalkyl ethers of ethylene glycol, monoalkyl ethers of condensed polyethylene glycol, dialkyl ethers of ethylene glycol, dialkyl ethers of condensed polyethylene glycol, and cyclic ethers containing not less than a 5 member ring, is suitable for use as a wire coating composition, passivation and/or protective coating composition(s) for semiconductor devices and the like. A part or all of the organic diamine may be a macrocyclic crown ether which enables the curable copolymer material to have a chemically bonded chelant embodies therein. The curable copolymer material may be of a block type configuration, a random type configuration, or both, and either may be cured at a low temperature such as ~75°C when diethylene glycol dimethylether is chosen as solvent.

  一种涂料组合物，包含一种可固化的共聚物材料，该材料是缩合反应的产物，最好是相应摩尔量的有机二胺和含有双氨基芳基醚或双氨基芳基硫醚和有机二酸酐的硅氧烷在至少一种有机溶剂中的缩合反应，这些有机溶剂选自乙二醇单烷基醚、缩聚聚乙二醇单烷基醚、缩聚聚乙二醇二烷基醚、以及含有不少于以下成分的环醚、乙二醇单烷基醚、缩合聚乙二醇二烷基醚、缩合聚乙二醇二烷基醚和含有不少于 5 个环的环状醚，适用于半导体设备等的线涂层组合物、钝化和/或保护涂层组合物。有机二胺的一部分或全部可以是大环冠醚，从而使可固化共聚物材料中含有化学键合的螯合物。可固化共聚物材料可以是块状结构，也可以是无规结构，或者两者兼而有之，并且都可以在低温下固化，例如选择二乙二醇二甲醚作为溶剂时，可以在 ~75°C 的温度下固化。
• EPOXY RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Takeda Sayaka

  公开号：US20140005318A1

  公开（公告）日：2014-01-02

  Disclosed is an epoxy resin composition which has excellent workability and excellent thermal resistance after curing. The epoxy resin composition contains a compound which has a specific imide structure obtained by reacting a diamine having a phenolic hydroxyl group, such as 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), with a tetracarboxylic dianhydride, and which has a number average molecular weight of 1,000 to 5,000; and a compound having at least two epoxy groups, such as a bisphenol A type epoxy resin.
• US4139547A
  申请人：——

  公开号：US4139547A

  公开（公告）日：1979-02-13
• US9123689B2
  申请人：——

  公开号：US9123689B2

  公开（公告）日：2015-09-01