p-phenylenebis-o-benzenedicarboxylic acid dianhydride | 34560-71-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并呋喃
• 英文名称: p-phenylenebis-o-benzenedicarboxylic acid dianhydride
• 英文别名: p-phenylenedibenzenedicarboxylic acid dianhydride；para-phenylenediphthalic acid dianhydride；p-phenylenediphthalic acid dianhydride；p-phenylenediphthalic acid anhydride；4-[4-(1,3-Dioxo-2-benzofuran-4-yl)phenyl]-2-benzofuran-1,3-dione
• CAS: 34560-71-9
• 化学式: C₂₂H₁₀O₆
• 分子量: 370.318
• InChiKey: QFKOAFCGCFIICV-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.9
• 重原子数：
  28
• 可旋转键数：
  2
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  86.7
• 氢给体数：
  0
• 氢受体数：
  6

文献信息

• Novel para- or meta-terphenyltetracarboxylic acid, dianhydride thereof and process for preparing the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP0247731A1

  公开（公告）日：1987-12-02

  Disclosed are a para- or meta-terphenyl-3,4,31,4"-tetracarboxylic acid or a dianhydride and a process for preparing the same. The para- or meta-terphenyl-3,4,3",4"-tetracarboxylic acid or a dianhydride thereof according to the present invention is a novel compound which is useful as a raw material for a polyimide having higher heat resistance and so on.

  本发明公开了一种对位或偏三联苯-3,4,31,4"-四羧酸或其二酸酐及其制备方法。 根据本发明，对位或偏三联苯-3,4,3",4"-四羧酸或其二酸酐是一种新型化合物，可用作具有更高耐热性等特性的聚酰亚胺的原料。
• Thermosetting resin composition and laminates and circuit board substrates made by using the same
  申请人：Tanaka Shigeru

  公开号：US20050119381A1

  公开（公告）日：2005-06-02

  A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.

  本发明的一种热固性树脂组合物包括(A)聚酰亚胺树脂，以及作为热固性成分的(B)多 官能辛酸酯和(C)环氧树脂中的至少一种。(A)聚酰亚胺树脂是一种可溶性聚酰亚胺，通过与二胺、包括醚键的酸酐反应获得。作为(B)的多功能辛酸酯，可使用具有特定结构的化合物和/或其低聚物。作为(C)环氧树脂，最好使用具有双环戊二烯骨架结构的环氧树脂和/或包括硅烷在内的烷氧基变性环氧树脂（合适的环氧树脂）。
• Resin composition
  申请人：——

  公开号：US20040176526A1

  公开（公告）日：2004-09-09

  The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.
• Polyimide Resin Composition, Polymer Film Containing Polymide Resin and Laminate Using the Same, and Method for Manufacturing Printed Wiring Board
  申请人：Shimoohsako Kanji

  公开号：US20070269665A1

  公开（公告）日：2007-11-22

  The present invention relates to a polyimide resin composition including an organic thiol compound and a thermoplastic polyimide resin, a polymeric film containing the polyimide resin, a laminate including the same, and a printed circuit board. By using the polyimide resin composition, it is possible to form an electroless plating film having high adhesive strength even under high-temperature, high-humidity conditions in spite of the fact that the surface roughness of the insulating layer is extremely low. Furthermore, by using the polymeric film and a laminate including the polymeric film and a metal layer, it is possible to obtain a printed circuit board capable of forming high-density circuit and having excellent adhesiveness, and excellent adhesion reliability in a high-temperature, high-humidity environment.
• Thermosetting Resin Composition and Use Thereof
  申请人：Tanaka Shigeru

  公开号：US20080230261A1

  公开（公告）日：2008-09-25

  A thermosetting resin composition contains a polyimide resin component (A) containing at least one polyimide resin, an amine component (B) containing at least one amine, an epoxy resin component (C) containing at least one epoxy resin, and an imidazole component (D) containing at least one imidazole.