cyclohex-3-enylmethyl t-butyl carbonate | 307929-95-9

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 有机碳酸及其衍生物
• 英文名称: cyclohex-3-enylmethyl t-butyl carbonate
• 英文别名: Tert-butyl cyclohex-3-en-1-ylmethyl carbonate
• CAS: 307929-95-9
• 化学式: C₁₂H₂₀O₃
• 分子量: 212.289
• InChiKey: ZJDVFVMNHVJSEW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.3
• 重原子数：
  15
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.75
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

文献信息

• Thermally degradable epoxy underfills for flip-chip applications
  申请人：——

  公开号：US20020013420A1

  公开（公告）日：2002-01-31

  A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

  提供了一种可重复加工的环氧封装材料，用于电子封装系统中，该系统包括集成电路、有机印刷线路板和至少一个共晶焊接点。所述封装材料的一个示例包括：环状脂肪族环氧树脂；有机固化剂；以及固化促进剂；其中所述环状脂肪族环氧树脂包括碳酸酯或氨基甲酸酯基团。封装材料还可以包括填料，如二氧化硅填料。还提供了一种形成上述可重复加工的环氧封装材料的方法。
• No-flow reworkable epoxy underfills for flip-chip applications
  申请人：——

  公开号：US20020035201A1

  公开（公告）日：2002-03-21

  A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.

  提供了一种用于电子封装系统的无流动可再加工环氧底层填充剂，该系统包含集成电路、有机印制电路板和至少一个形成于其间的共晶焊点。封装剂的一个示例性实施例包括：环脂族环氧化物；有机固化剂；固化促进剂；以及助焊剂，其中所述环脂族环氧化物包括碳酸盐或氨基甲酸酯基团。封装剂还可以包括填料，如二氧化硅填料。此外，还提供了一种用于形成上述可再加工环氧底层填料的方法。
• US6498260B2
  申请人：——

  公开号：US6498260B2

  公开（公告）日：2002-12-24
• US6570029B2
  申请人：——

  公开号：US6570029B2

  公开（公告）日：2003-05-27
• [EN] NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS<br/>[FR] MATERIAUX DE REMPLISSAGE SOUS-JACENT, EPOXYDES, REMANIABLES ET SANS ECOULEMENT, DESTINES A DES APPLICATIONS RELATIVES A DES PUCES A PROTUBERANCES
  申请人：GEORGIA TECH RES INST

  公开号：WO2001088959A2

  公开（公告）日：2001-11-22

  A no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.