1,3-Dioxo-2-benzofuran-5-carboxylic acid;ethane-1,2-diol | 90412-25-2

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 苯并呋喃
• 英文名称: 1,3-Dioxo-2-benzofuran-5-carboxylic acid;ethane-1,2-diol
• CAS: 90412-25-2
• 化学式: C11H10O7
• 分子量: 254.19
• InChiKey: NSAFGSKTIIFYHE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.33
• 重原子数：
  18
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.18
• 拓扑面积：
  121
• 氢给体数：
  3
• 氢受体数：
  7

文献信息

• EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR
  申请人：Nippon Kayaku Kabushiki Kaisha

  公开号：EP1548043A1

  公开（公告）日：2005-06-29

  The present invention relates to an epoxy resin composition for sealing photosemiconductor, the epoxy resin composition containing (A) a bisphenol-type epoxy resin represented by the following formula (1) (in the formula, R1s represent hydrogen atom, a C1 - C8 alkyl group, a halogen atom; R2s represent hydrogen atom, a C1 - C5 alkyl group, a halogen-substituted (C1 - C5) alkyl group or phenyl group; n represents an integer), where the ratio of the total content of such bisphenol-type lower molecular epoxy resins with n = 0, 1 or 2 is 10% by weight or more of the whole resin; (B) a terpene backbone-containing polyvalent phenol curing agent prepared by adding two molecules of phenols to one molecule of a cyclic terpene compound; (C) a curing-promoting agent; (D) at least one resin selected from the group consisting of epoxy resins except for the component (A) and novolak resins as a curing agent; and an photosemiconductor device sealed with the cured material of the composition, where the composition has great workability and good productivity of sealed photosemiconductor, so that the resulting photosemiconductor sealed with the cured material of the composition has great solder reflowresistance after moisture absorption and good thermal resistance for HC.

  本发明涉及一种用于密封光半导体的环氧树脂组合物，该环氧树脂组合物包含 (A) 由下式(1)表示的双酚型环氧树脂 (式中，R1s 代表氢原子、C1-C8 烷基、卤素原子；R2s 代表氢原子、C1-C5 烷基、卤素取代的(C1-C5)烷基或苯基；n 代表整数)，其中，n=0、1 或 2 的双酚型低分子环氧树脂的总含量占整个树脂重量的比例为 10%或以上； (B) 一种含萜烯骨架的多价酚固化剂，其制备方法是在一分子环状萜烯化合物中 加入两分子酚，其中一分子酚的重量比为 10%或以上； (C) 一种固化促进剂； (D) 至少一种选自环氧树脂（成分(A)除外）和酚醛树脂组成的组的树脂作为固化剂； 以及用该组合物的固化材料密封的光电半导体器件，其中该组合物具有极佳的可加工性和密封光电半导体的良好生产率，因此用该组合物的固化材料密封的光电半导体在吸湿后具有极佳的耐回流焊性和良好的耐热性。
• POLYEPOXY COMPOUND, METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION CONTAINING SAME, CURED PRODUCT OF SUCH COMPOSITION, AND METHOD FOR REMOVING SUCH CURED PRODUCT
  申请人：KANSAI PAINT CO., LTD.

  公开号：EP1803758A1

  公开（公告）日：2007-07-04

  The present invention provides a specific polyepoxy compound having at least two olefin oxide groups and at least one tertiary ester group per molecule, a method for producing the compound, a thermosetting resin composition containing the compound, a cured product of the composition, and a method for removing the cured product.

  本发明提供了一种特定的聚环氧化合物（每个分子至少有两个氧化烯烃基团和至少一个叔酯基团）、一种生产该化合物的方法、一种含有该化合物的热固性树脂组合物、一种该组合物的固化产物以及一种去除固化产物的方法。
• A NEW LUMBER ADHESIVE AND THE PREPARATION THEREOF
  申请人：Yang, Guang

  公开号：EP2236578A1

  公开（公告）日：2010-10-06

  The present invention provides a new lumber adhesive, which comprises: 100 parts by weight water, 3-45 parts by weight proteinic raw material, 0.01-15 parts by weight acidity adjusting agent, 0.01-15 parts by weight aromatic compound, 0.01-15 parts by weight curing agent, 0.01-15 parts by weight antiseptic, 0.01-15 parts by weight viscosity regulator, 0-10 parts by weight filler and 0-15 parts by weight drier. The new lumber adhesive of the present invention can be used for adhesion of wood, veneer, flackboard, oriented strand boards (OSB), fibreboard, hard fibreboard, intermediate density board, high density board, cabinetwork board, man-made facing plate, floor substrate material and LVL. The present invention also provides the preparation of the new lumber adhesive.

  本发明提供了一种新型木材粘合剂，它包括100份（重量）水、3-45份（重量）蛋白质原料、0.01-15份（重量）酸度调节剂、0.01-15份（重量）芳香化合物、0.01-15份（重量）固化剂、0.01-15份（重量）防腐剂、0.01-15份（重量）粘度调节剂、0-10份（重量）填料和0-15份（重量）干燥剂。本发明的新型木材粘合剂可用于粘合木材、单板、刨花板、定向刨花板（OSB）、纤维板、硬纤维板、中密度板、高密度板、橱柜板、人造面板、地板基材和 LVL。本发明还提供了新型木材粘合剂的制备方法。
• PROCESS FOR PRODUCTION OF CURED MOLDED ARTICLE, AND CURED MOLDED ARTICLE
  申请人：Nippon Shokubai Co., Ltd.

  公开号：EP2479209A1

  公开（公告）日：2012-07-25

  Provided is a process for production of a cured molded article capable of readily producing a transparent and discoloration-free cured molded article that exhibits a low shrinkage ratio and an excellent heat resistance, abrasion resistance, and mold release behavior. Also provided is a cured molded article that is useful in a variety of applications, for example, as an optical member. The process for production of a cured molded article from a curable resin composition that comprises a condensable inorganic compound, a curable organic compound, and a curing agent is a process for production of a cured molded article including a first step composed of a step of thermally curing the curable resin composition at 80 to 200°C and/or a step of curing the curable resin composition by exposure to active-energy radiation, and a second step of subjecting the cured material obtained in the first step to a thermal cure at above 200°C but not more than 500°C.

  本发明提供了一种固化成型品的生产工艺，该工艺能够轻松生产出透明且无变色的固化成型品，该成型品具有较低的收缩率和出色的耐热性、耐磨性和脱模性。此外，还提供了一种固化成型品，可用于多种用途，例如光学部件。由可凝结无机化合物、可固化有机化合物和固化剂组成的可固化树脂组合物生产固化成型品的工艺是一种生产固化成型品的工艺，包括第一步，在 80 至 200°C 的温度下对可固化树脂组合物进行热固化和/或通过暴露于活性能量辐射对可固化树脂组合物进行固化；第二步，将第一步中获得的固化材料在 200°C 以上但不超过 500°C 的温度下进行热固化。
• RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND COMMODITY
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3623422A1

  公开（公告）日：2020-03-18

  An aspect of the present invention is a resin composition comprising: an acrylic resin; and a curing agent, wherein the acrylic resin is a resin obtained by polymerizing monomer components comprising a first monomer represented by the following formula (1): wherein R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12 to 30 carbon atoms, and a second monomer copolymerizable with the first monomer and having a reactive group capable of reacting with the curing agent.

  本发明的一个方面是一种树脂组合物，包括：丙烯酸树脂；和固化剂，其中丙烯酸树脂是通过聚合由下式（1）表示的第一单体组成的单体组分而得到的树脂： 其中 R1 代表氢原子或甲基，R2 代表具有 12 至 30 个碳原子的烷基，以及可与第一单体共聚且具有可与固化剂反应的活性基团的第二单体。