silver titanium | 12002-89-0

• 分子结构分类: 无机化合物 - 均相金属化合物 - 均相过渡金属化合物
• 英文名称: silver titanium
• 英文别名: titanium-silver；Silver;titanium
• CAS: 12002-89-0
• 化学式: AgTi
• 分子量: 155.748
• InChiKey: MZFIXCCGFYSQSS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.01
• 重原子数：
  2
• 可旋转键数：
  0
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为反应物：
  描述：

  氨 、 silver titanium 以 neat (no solvent) 为溶剂， 生成 镍化钛 、 银
  参考文献：
  名称：

  使用 Ag-Ti 合金/双层结构和 NH3 环境通过 Ti 反应在 SiO2 上封装 Ag 薄膜

  摘要：

  通过氮化~200nm厚的Ag-19at在氧化硅上制备了薄的封装银膜。% Ti 合金薄膜和 Ag(120 nm)/Ti(22 nm) 在 300–700 °C 的氨环境中。通过卢瑟福背向散射、扫描俄歇和二次离子质谱对封装过程进行了详细研究，结果表明在表面和 Ag-Ti/SiO2 界面处形成了氮化钛和氧化钛硅化物，分别。合金薄膜的四点探针分析表明电阻率受残余 Ti 浓度控制。在初始低 Ti 浓度的封装 Ag 合金膜中测量到约 4 μΩ cm 的电阻率值。退火的双层结构在 Ag 中具有最小的 Ti 积累，电阻率值与沉积的 Ag（~3 μΩ cm）相当。

  DOI：

  10.1063/1.116564
• 作为产物：
  描述：

  银 、 四氢化物钛 以 melt 为溶剂， 生成 silver titanium
  参考文献：
  名称：

  一些贵金属（Cu、Ag、Au）和过渡金属的二元合金的高温直接合成量热法热化学

  摘要：

  摘要 通过高温直接合成量热法在 1372 K 下测量了一些贵金属-过渡金属化合物的标准生成焓。报告了以下结果（以 kJ/mol 原子为单位）：Cu51Zr14，-24.3±2.2；Cu3Pd，-7.6±1.2；Cu51Hf14，-22.9±2.3；Cu3Pt，-10.8±1.1；AgTi，-1.6±2.4；AgTi2，-2.3±1.1；Ag2Y，-26.6±1.2；Au2Sc，-83.4±1.8；Au4Sc，-57.3±1.5；金锰，-25.3±1.7；Au2Y，-84.6±1.8；Au3Y，-69.1±1.9；Au3Pd，-7.9±1.9。将结果与通过 EMF、蒸气压和量热法获得的一些早期实验值进行比较。还将它们与 Miedema 和同事的预测值进行比较。我们将展示生成焓如何与过渡金属的原子序数相关的系统图。

  DOI：

  10.1016/s0925-8388(02)00983-0

文献信息

• Structure and mechanical properties of Ti-Based alloys containing Ag subjected to a thermomechanical treatment
  作者：Vladislav Zadorozhnyy、Alexey Kopylov、Mikhail Gorshenkov、Elena Shabanova、Mikhail Zadorozhnyy、Alexander Novikov、Aleksey Maksimkin、Takeshi Wada、Dmitri V. Louzguine-Luzgin、Hidemi Kato

  DOI：10.1016/j.jallcom.2018.12.152

  日期：2019.4

  Here we report on the structure and mechanical properties of low-alloyed Ti-based alloys containing Ag subjected to a dual-axial forging operation. The dependence of the microstructure and mechanical properties on the regimes of the dual-axial forging operation is studied for the Ti94Ag3Pd3 alloy having the optimal properties. The hemolytical activity of the Ti94Ag3Pd3 alloy was also investigated. The percent hemolysis induced by the sample after 5 h of incubation is much lower than that for the surgical titanium after 4 h of incubation. Doping of the Ti94Ag3Pd3 by a minor amount of nitrogen (N) improved its mechanical properties and decreased its elastic modulus (to 65 MPa), which is attractive for biological applications. (C) 2018 Elsevier B.V. All rights reserved.
• Structure and properties of Ti-Ag alloys produced by powder metallurgy
  作者：Barbara Szaraniec、Tomasz Goryczka

  DOI：10.1016/j.jallcom.2017.03.155

  日期：2017.6

  Titanium alloys varying in the silver content (3.5 at.%; 5 at.%; 10 at.% or 20 at.%) were produced by means of powder metallurgy. The alloys displayed different phase structure. In alloys with the silver content of 3.5 at.% and 5 at.% the solid solution alpha-Ti was identified. In alloys with the higher silver content, i.e. 10 and 20 at.%, both the solid solution and the equilibrium phase Ti2Ag were observed, whereas in alloys with the highest silver content of 20 at.% there were also the equilibrium phase TiAg and fine silver identified. The Ti-20%Ag alloy had 80% lower compressive stress and 30% lower hardness compared to the Ti-10%Ag alloy. The alloy with 10% silver showed the best mechanical properties as well as the best surface wettability. (C) 2017 Elsevier B.V. All rights reserved.
• Thermochemistry of some binary alloys of noble metals (Cu, Ag, Au) and transition metals by high temperature direct synthesis calorimetry
  作者：S.V. Meschel、O.J. Kleppa

  DOI：10.1016/s0925-8388(02)00983-0

  日期：2003.2

  Abstract The standard enthalpies of formation of some noble metal–transition metal compounds have been measured by high temperature direct synthesis calorimetry at 1372 K. The following results (in kJ/mol of atoms) are reported; Cu51Zr14, −24.3±2.2; Cu3Pd, −7.6±1.2; Cu51Hf14, −22.9±2.3; Cu3Pt, −10.8±1.1; AgTi, −1.6±2.4; AgTi2, −2.3±1.1; Ag2Y, −26.6±1.2; Au2Sc, −83.4±1.8; Au4Sc, −57.3±1.5; AuMn, −25

  摘要 通过高温直接合成量热法在 1372 K 下测量了一些贵金属-过渡金属化合物的标准生成焓。报告了以下结果（以 kJ/mol 原子为单位）：Cu51Zr14，-24.3±2.2；Cu3Pd，-7.6±1.2；Cu51Hf14，-22.9±2.3；Cu3Pt，-10.8±1.1；AgTi，-1.6±2.4；AgTi2，-2.3±1.1；Ag2Y，-26.6±1.2；Au2Sc，-83.4±1.8；Au4Sc，-57.3±1.5；金锰，-25.3±1.7；Au2Y，-84.6±1.8；Au3Y，-69.1±1.9；Au3Pd，-7.9±1.9。将结果与通过 EMF、蒸气压和量热法获得的一些早期实验值进行比较。还将它们与 Miedema 和同事的预测值进行比较。我们将展示生成焓如何与过渡金属的原子序数相关的系统图。
• Encapsulation of Ag films on SiO₂ by Ti reactions using Ag–Ti alloy/bilayer structures and an NH₃ ambient
  作者：T. L. Alford、Daniel Adams、T. Laursen、B. Manfred Ullrich

  DOI：10.1063/1.116564

  日期：1996.6.3

  Four‐point‐probe analysis of the alloy films suggests that the resistivity is controlled by the residual Ti concentration. Resistivity values of ∼4 μΩ cm were measured in encapsulated Ag alloy films with initial low Ti concentrations. The annealed bilayer structure had minimal Ti accumulations in Ag and the resistivity values were comparable to that of the as‐deposited Ag (∼3 μΩ cm).

  通过氮化~200nm厚的Ag-19at在氧化硅上制备了薄的封装银膜。% Ti 合金薄膜和 Ag(120 nm)/Ti(22 nm) 在 300–700 °C 的氨环境中。通过卢瑟福背向散射、扫描俄歇和二次离子质谱对封装过程进行了详细研究，结果表明在表面和 Ag-Ti/SiO2 界面处形成了氮化钛和氧化钛硅化物，分别。合金薄膜的四点探针分析表明电阻率受残余 Ti 浓度控制。在初始低 Ti 浓度的封装 Ag 合金膜中测量到约 4 μΩ cm 的电阻率值。退火的双层结构在 Ag 中具有最小的 Ti 积累，电阻率值与沉积的 Ag（~3 μΩ cm）相当。