An organosilicon compound is provided comprising an organic functional radical having a photopolymerizable double bond linked to a hydrolyzable radical-bonded silicon atom via a divalent organic radical containing a urea bond. Due to the inclusion of amide, urethane or urea bond structure and a photopolymerizable functional radical, the organosilicon compound has excellent compatibility with resins. The method is capable of preparing the organosilicon compound having a minimal chlorine content.
提供了一种
有机硅化合物,其包含一个有机官能基,该有机官能基具有光聚合双键,通过一个二价有机基含有
尿素键,与一个
水解基团键合的
硅原子相连。由于包含酰胺、
脲或
尿素键结构和光聚合官能基,该
有机硅化合物与
树脂具有良好的相容性。该方法能够制备具有最小
氯含量的
有机硅化合物。