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3,12-Dioxa-6,9-diazoniadispiro[5.2.5.2]hexadecane | 183-89-1

中文名称
——
中文别名
——
英文名称
3,12-Dioxa-6,9-diazoniadispiro[5.2.5.2]hexadecane
英文别名
3,12-dioxa-6,9-diazoniadispiro[5.2.59.26]hexadecane
3,12-Dioxa-6,9-diazoniadispiro[5.2.5.2]hexadecane化学式
CAS
183-89-1
化学式
C12H24N2O2+2
mdl
——
分子量
228.33
InChiKey
XYCLZGQKBCMLBY-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -0.6
  • 重原子数:
    16
  • 可旋转键数:
    0
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    18.5
  • 氢给体数:
    0
  • 氢受体数:
    2

文献信息

  • PATTERN FORMING METHOD, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    申请人:FUJIFILM Corporation
    公开号:US20160041465A1
    公开(公告)日:2016-02-11
    The pattern forming method includes (1) forming a film using an active light sensitive or radiation sensitive resin composition, (2) exposing the film to active light or radiation, and (3) developing the exposed film using a developer including an organic solvent, in which the active light sensitive or radiation sensitive resin composition contains a resin (A) having a group which generates a polar group by being decomposed due to the action of an acid, the resin (A) has a phenolic hydroxyl group and/or a phenolic hydroxyl group protected with a group leaving due to the action of an acid, and the developer including the organic solvent contains an additive which forms at least one interaction of an ionic bond, a hydrogen bond, a chemical bond, and a dipole interaction, with the polar group.
  • RESIST PATTERN-FORMING METHOD
    申请人:JSR CORPORATION
    公开号:US20170075224A1
    公开(公告)日:2017-03-16
    A resist pattern-forming method comprises applying a chemically amplified resist material on a substrate to form a resist film on the substrate. The resist film is patternwise exposed to a radioactive ray having a wavelength of no greater than 250 nm. The resist film patternwise exposed is floodwise exposed to a radioactive ray having a wavelength of greater than 250 nm. The resist film floodwise exposed is baked and developed with a developer solution comprising an organic solvent. The chemically amplified resist material comprises a component that is capable of generating a radiation-sensitive sensitizer and an acid upon an exposure. The component comprises: a radiation-sensitive sensitizer generating agent, and at least one of a radiation-sensitive acid-and-sensitizer generating agent and a radiation-sensitive acid generating agent. The radiation-sensitive sensitizer generating agent comprises a compound represented by formula (B).
  • US9651863B2
    申请人:——
    公开号:US9651863B2
    公开(公告)日:2017-05-16
  • US9939729B2
    申请人:——
    公开号:US9939729B2
    公开(公告)日:2018-04-10
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