An etchant composition and a method of fabricating a semiconductor device, the composition including an inorganic acid; about 0.01 parts by weight to about 0.5 parts by weight of colloidal silica; about 0.01 parts by weight to about 30 parts by weight of an ammonium-based additive; and about 20 parts by weight to about 50 parts by weight of a solvent, all parts by weight being based on 100 parts by weight of the inorganic acid.
一种蚀刻剂组合物和一种制造半导体器件的方法,该组合物包括一种
无机酸;按重量计约0.01份至约0.5份的胶体
二氧化硅;按重量计约0.01份至约30份的
铵基添加剂;以及按重量计约20份至约50份的溶剂,所有按重量计的份数均以100份
无机酸为基准。