申请人:FUJIFILM Corporation
公开号:US11175585B2
公开(公告)日:2021-11-16
An object of the present invention is to provide a treatment liquid which is capable of suppressing the generation of defects of a semiconductor device and has excellent corrosion resistance and wettability. The treatment liquid of the present invention is a treatment liquid for a semiconductor device, containing at least one organic solvent selected from the group consisting of ethers, ketones, and lactones, water, and a metal component including at least one metal element selected from the group consisting of Na, K, Ca, Fe, Cu, Mg, Mn, Li, Al, Cr, Ni, Ti, and Zn, in which the content of water in the treatment liquid is 100 ppb by mass to 100 ppm by mass and the content of the metal component in the treatment liquid is 10 ppq by mass to 10 ppb by mass.
本发明的目的是提供一种处理液,它能够抑制半导体器件缺陷的产生,并具有优异的耐腐蚀性和润湿性。本发明的处理液是一种用于半导体器件的处理液,含有至少一种选自由醚、酮和内酯组成的组的有机溶剂、水和金属成分,其中金属成分包括至少一种选自由 Na、K、Ca、Fe、Cu、Mg、Mn、Li、Al、Cr、Ni、Ti 和 Zn 所组成的组中的至少一种金属元素,其中处理液中水的含量为 100 ppb(质量分数)至 100 ppm(质量分数),处理液中金属成分的含量为 10 ppq(质量分数)至 10 ppb(质量分数)。