Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition comprising: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10°C or higher and lower than 60°C in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.
本发明提供了一种
树脂组合物,通过该
树脂组合物可以获得一种散热片,该散热片对抑制电子部件(元件)产生的热量引起的温度升高具有很高的效果。具体而言,本发明提供了一种
树脂组合物,该
树脂组合物包括:聚合物(1),其在差示扫描量热法中观察到的高于 10°C 低于 60°C 的温度范围内的熔焓大于等于 30 J/g;导热材料(3),其导热系数大于等于 1 W/(m-K),其中导热材料(3)的含量为 1 份(按重量计)以上,80 份(按重量计)以下(相对于
树脂组合物所含聚合物成分总量的 100 份(按重量计))。