bis-(4-hydroxy-3,5-dimethylphenyl)(4-aminophenyl)methane | 355149-53-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: bis-(4-hydroxy-3,5-dimethylphenyl)(4-aminophenyl)methane
• 英文别名: 4,4'-[(4-Aminophenyl)methylene]bis(2,6-dimethylphenol)；4-[(4-aminophenyl)-(4-hydroxy-3,5-dimethylphenyl)methyl]-2,6-dimethylphenol
• CAS: 355149-53-0
• 化学式: C₂₃H₂₅NO₂
• 分子量: 347.457
• InChiKey: KQEOHEQHHWKMDO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.4
• 重原子数：
  26
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.22
• 拓扑面积：
  66.5
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  bis(4-hydroxy-3,5-dimethylphenyl)(4-nitrophenyl)methane 在 palladium 10% on activated carbon 、 氢气 作用下， 以 乙醇 为溶剂， 反应 12.0h， 以89.9%的产率得到bis-(4-hydroxy-3,5-dimethylphenyl)(4-aminophenyl)methane
  参考文献：
  名称：

  SUBSTITUTED OR UNSUBSTITUTED ALLYL GROUP-CONTAINING MALEIMIDE COMPOUND, PRODUCTION METHOD THEREFOR, AND COMPOSITION AND CURED PRODUCT USING SAID COMPOUND

  摘要：

  亚苯基马来酰亚胺化合物，具有三个或更多苯环的结构，含有一个或多个取代或未取代的烯丙基团，以及一个或多个马来酰亚胺基团，具有卓越的耐热性。

  公开号：

  US20200325101A1

文献信息

• CURING AGENTS FOR EPOXY RESINS
  申请人：Dershem Stephen M

  公开号：US20130012620A1

  公开（公告）日：2013-01-10

  The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.

  本发明涉及环氧树脂的硬化剂，以及含有经相同制备方法固化的这种树脂的组合物（例如胶粘剂）及其用途。更具体地，本发明涉及用于环氧树脂的混合硬化剂，包括芳香胺、酚和/或苯酯基团。本发明的另一个方面涉及具有优异固化潜伏期和低固化温度起始点的新咪唑催化剂。
• Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound
  申请人：DIC Corporation

  公开号：US10981865B2

  公开（公告）日：2021-04-20

  Bismaleimides (BMI) exhibit excellent heat resistance (high Tg and high resistance to thermal decomposition) compared to epoxy resins and phenolic resins, and therefore, in recent years, more attention is paid to bismaleimides as a resin material for the next-generation devices represented by SiC power semiconductors, in addition to the investigation on the use of bismaleimides for electronic material applications. As such, conventional BMI's are known as highly heat-resistant resins; however, there is a demand for a resin having higher heat resistance for advanced material applications and the like. Thus, an object of the invention is to provide a novel maleimide compound having superior heat resistance. Disclosed is a substituted or unsubstituted allyl group-containing maleimide compound having a structure with three or more benzene rings, having one or more groups each having a substituted or unsubstituted allyl group, and having one or more maleimide groups.

  与环氧树脂和酚醛树脂相比，双马来酰亚胺（BMI）具有优异的耐热性（高 Tg 和高抗热分解性），因此近年来，除了研究双马来酰亚胺在电子材料应用中的使用外，人们还更加关注双马来酰亚胺作为以 SiC 功率半导体为代表的下一代设备的树脂材料。因此，传统的双马来酰亚胺是众所周知的高耐热性树脂；然而，在先进材料应用等方面，需要一种具有更高耐热性的树脂。因此，本发明的目的是提供一种具有优异耐热性的新型马来酰亚胺化合物。本发明公开了一种含取代或未取代烯丙基的马来酰亚胺化合物，其结构具有三个或三个以上苯环，具有一个或多个基团，每个基团具有一个取代或未取代烯丙基，并具有一个或多个马来酰亚胺基团。
• US8288591B2
  申请人：——

  公开号：US8288591B2

  公开（公告）日：2012-10-16
• [EN] CURING AGENTS FOR EPOXY RESINS<br/>[FR] AGENTS DE POLYMÉRISATION POUR RÉSINES ÉPOXY
  申请人：DESIGNER MOLECULES INC

  公开号：WO2011116050A2

  公开（公告）日：2011-09-22

  The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.