1,3-Diallyl-5-phenyl-2,4,6-trioxo-perhydro-1,3,5-triazin | 57399-70-9

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: 1,3-Diallyl-5-phenyl-2,4,6-trioxo-perhydro-1,3,5-triazin
• 英文别名: 1,3-Diallyl-5-phenyl-2,4,6-trioxo-perhydro-<1,3,5>triazin；1,3-diallyl-5-phenyl-[1,3,5]triazinane-2,4,6-trione；1-Phenyl-3,5-bis(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione
• CAS: 57399-70-9
• 化学式: C₁₅H₁₅N₃O₃
• 分子量: 285.302
• InChiKey: XMFXZLHKPAHCSU-UHFFFAOYSA-N

物化性质

• 熔点：
  68 °C
• 沸点：
  416.6±38.0 °C(Predicted)
• 密度：
  1.231±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  2.2
• 重原子数：
  21
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.13
• 拓扑面积：
  60.9
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  1,3-Diallyl-5-phenyl-2,4,6-trioxo-perhydro-1,3,5-triazin 生成 1,3-Dipropyl-5-phenyl-2,4,6-trioxo-perhydro-<1,3,5>triazin
  参考文献：
  名称：

  ETIENNE A.; LONCHAMBON G.; BONTE B.; ROQUES J., C. R. ACAD. SCI. , 1975, C 281, NO 9, 275-278

  摘要：

  DOI：
• 作为产物：
  描述：

  4-Allyl-2-phenyl-ethylallophanat 生成 1,3-Diallyl-5-phenyl-2,4,6-trioxo-perhydro-1,3,5-triazin
  参考文献：
  名称：

  ETIENNE A.; LONCHAMBON G.; ROQUES J., C. R. ACAD. SCI., 1976, C 283, NO 11, 491-494

  摘要：

  DOI：

文献信息

• HARDENABLE COMPOSITION, HARDENING PRODUCT, PROCESS FOR PRODUCING THE SAME AND LIGHT EMITTING DIODE SEALED WITH THE HARDENING PRODUCT
  申请人：KANEKA CORPORATION

  公开号：EP1505121A1

  公开（公告）日：2005-02-09

  The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.

  本发明提供了一种可固化组合物，该组合物提供了一种具有优异粘合性能和高透明度的固化产品，或一种具有高韧性和高透明度的固化产品。 一种可固化组合物，其中包含：(A) 每分子中至少有两个碳碳双键与 SiH 基团反应的有机化合物；(B) 每分子中至少有两个 SiH 基团的硅化合物；(C) 水硅烷化催化剂；(D) 硅烷偶联剂和/或含环氧基团的化合物；以及 (E) 硅烷醇缩合催化剂。一种密封有固化产物的发光二极管，该固化产物可通过固化所述可固化组合物获得。
• CURABLE RESIN COMPOSITION, AND CURED PRODUCT, SEALING AGENT, AND OPTICAL SEMICONDUCTOR DEVICE USING SAME
  申请人：Daicel Corporation

  公开号：EP2857457A1

  公开（公告）日：2015-04-08

  Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide). The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard.

  本发明提供了一种可固化树脂组合物，该组合物能够形成具有优异耐热性、透明度和柔韧性的固化产品，尤其是对腐蚀性气体（如氧化硫）具有优异的阻隔性能。 可固化树脂组合物包括含有脂肪族碳-碳不饱和键的化合物（U）和含有氢硅烷基的化合物（H），并包括梯形硅倍半氧烷[A1]和梯形硅倍半氧烷[A2]中的至少一种，其中梯形硅倍半氧烷[A1]含有脂肪族碳-碳不饱和键，其数均分子量为 500-1500，分子量分散度（Mw/Mn）为 1.阶梯型硅倍半氧烷[A2]含有一个氢硅烷基，平均分子量为500-1500，分子量分散度（Mw/Mn）为1.00-1.40（通过凝胶渗透色谱法测定，并用聚苯乙烯标准校准）。
• Adherent silicone coating
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP0391163B1

  公开（公告）日：1995-03-08
• Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
  申请人：Tsumura Manabu

  公开号：US20050209400A1

  公开（公告）日：2005-09-22

  The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
• CURABLE COMPOSITION
  申请人：Ichiryu Yoshikatsu

  公开号：US20100222525A1

  公开（公告）日：2010-09-02

  Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same. Disclosed is a modified polyorganosiloxane compound having two or more epoxy group and/or oxetanyl group in a molecule, the compound being a hydrosilylation reaction product of the following compounds: (α 1 ) an organic compound having 2 to 6 carbon-carbon double bonds reactive with a SiH group in a molecule; (β1) a linear and/or cyclic polyorganosiloxane compound having at least two SiH groups in a molecule; and (γ1) an organic compound having at least one epoxy group or oxetanyl group and one carbon-carbon double bond reactive with a SiH group in a molecule.