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2,2',2''-{Ethane-1,1,1-triyltris[(2,1-phenylene)oxymethylene]}tris(oxirane) | 639007-14-0

中文名称
——
中文别名
——
英文名称
2,2',2''-{Ethane-1,1,1-triyltris[(2,1-phenylene)oxymethylene]}tris(oxirane)
英文别名
2-[[2-[1,1-bis[2-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane
2,2',2''-{Ethane-1,1,1-triyltris[(2,1-phenylene)oxymethylene]}tris(oxirane)化学式
CAS
639007-14-0
化学式
C29H30O6
mdl
——
分子量
474.5
InChiKey
OSESZSRPDCSMIP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4.8
  • 重原子数:
    35
  • 可旋转键数:
    12
  • 环数:
    6.0
  • sp3杂化的碳原子比例:
    0.38
  • 拓扑面积:
    65.3
  • 氢给体数:
    0
  • 氢受体数:
    6

文献信息

  • Organic compositions
    申请人:——
    公开号:US20040247896A1
    公开(公告)日:2004-12-09
    The present composition provides a composition comprising: (a) thermosetting component wherein the thermosetting component comprises monomer having the structure dimer having the structure or a mixture of the monomer and the dimer wherein Y is selected from cage compound and silicon atom; R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 are independently selected from aryl, branched aryl, and arylene ether; at least one of the aryl, the branched aryl, and the arylene ether has an ethynyl group; R 7 is aryl or substituted aryl; and at least one of the R 1 , R 2 , R 3 , R 4 , R 5 , and R 6 comprises at least two isomers; and (b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to a substrate. The present composition is particularly useful as a dielectric material in microelectronic 1
    本组合物提供了一种组合物,包括:(a)热固性组分,其中热固性组分包括具有二聚体结构或混合物的单体,其中Y选自笼状化合物和硅原子;R1、R2、R3、R4、R5和R6分别独立地选自芳基、支链芳基和芳基醚;其中至少一个芳基、支链芳基和芳基醚具有一个乙炔基;R7是芳基或取代芳基;其中至少一个R1、R2、R3、R4、R5和R6包含至少两个异构体;以及(b)粘附促进剂,包括至少具有双重功能性的化合物,其中双重功能性可以相同或不同,第一功能能够与热固性组分(a)相互作用,第二功能能够与基底相互作用,当该组合物应用于基底时,本组合物特别适用于微电子中的介电材料。
  • Compositions, coatings and films for tri-layer patterning applications and methods of preparation thereof
    申请人:Kennedy Joseph
    公开号:US20080206690A1
    公开(公告)日:2008-08-28
    Compositions for use in tri-layer applications are described herein, wherein the composition has a matrix and includes: a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, at least one condensation catalyst, and at least one solvent. Tri-layer structures are also contemplated herein that comprise an organic underlayer (first layer), antireflective compositions and/or films contemplated herein (second layer) and a photoresist material (third layer) that are coupled to one another. Methods of producing a composition for tri-layer patterning applications includes: providing a formulated polymer comprising at least one type of silicon-based moiety forming the matrix of the polymer, a plurality of vinyl groups coupled to the matrix of the polymer, and a plurality of phenyl groups coupled to the matrix of the polymer, providing at least one condensation catalyst, providing at least one solvent, providing at least one pH modifier, blending the formulated polymer and part of the at least one solvent in a reaction vessel to form a reactive mixture; and incorporating the at least one pH modifier, the at least one condensation catalyst and the remaining at least one solvent into the reactive mixture to form the composition.
    本文描述了用于三层应用的组合物,其中该组合物具有一个基质,包括:一种经过配制的聚合物,该聚合物的基质包含至少一种硅基基团,与基质相偶联的多个乙烯基和多个苯基,至少一种缩合催化剂和至少一种溶剂。本文还考虑了三层结构,包括有机底层(第一层)、反射率组合物和/或膜(第二层)以及与其相偶联的光阻材料(第三层)。制备用于三层图案应用的组合物的方法包括:提供一种经过配制的聚合物,该聚合物的基质包括至少一种硅基基团,与基质相偶联的多个乙烯基和多个苯基,提供至少一种缩合催化剂,提供至少一种溶剂,提供至少一种pH调节剂,将经过配制的聚合物和至少一部分溶剂混合在反应容器中形成反应混合物;并将至少一种pH调节剂、至少一种缩合催化剂和剩余的至少一种溶剂混入反应混合物中形成组合物。
  • Anti-Reflective Coating for Photolithography and Methods of Preparation Thereof
    申请人:Baldwin Teresa
    公开号:US20140227538A1
    公开(公告)日:2014-08-14
    Anti-reflective coating materials for ultraviolet photolithography include at least one absorbing compound and at least one material modification agent, such as at least one porogen, at least one high-boiling solvent, at least one capping agent, at least one leveling agent, at least one catalyst, at least one replacement solvent, at least one pH tuning agent, and/or a combination thereof that are incorporated into inorganic-based materials or inorganic compositions and/or compounds. Suitable absorbing compounds
    用于紫外光刻的防反射涂层材料包括至少一种吸收化合物和至少一种材料改性剂,例如至少一种多孔剂、至少一种高沸点溶剂、至少一种封顶剂、至少一种平整剂、至少一种催化剂、至少一种替代溶剂、至少一种pH调节剂和/或它们的组合,这些材料被纳入无机基材料或无机组合物和/或化合物中。适合的吸收化合物
  • Semiconductor device manufacturing method and underfill film
    申请人:DEXERIALS CORPORATION
    公开号:US10280347B2
    公开(公告)日:2019-05-07
    A method for manufacturing a semiconductor device and an underfill film which can achieve voidless mounting and excellent solder bonding properties even in the case of collectively bonding a plurality of semiconductor chips are provided. The method includes a mounting step of mounting a plurality of semiconductor chips having a solder-tipped electrode onto an electronic component having a counter electrode opposing the solder-tipped electrode via an underfill film; and a compression bonding step of collectively bonding the plurality of semiconductor chips to the electronic component via the underfill film. The underfill film contains an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide and has a minimum melt viscosity of 1,000 to 2,000 Pa*s and a melt viscosity gradient of 900 to 3,100 Pa*s/° C. from a temperature 10° C. higher than a minimum melt viscosity attainment temperature to a temperature 10° C. higher than the temperature.
    本发明提供了一种用于制造半导体器件的方法和一种底部填充膜,即使在多个半导体芯片集体接合的情况下,也能实现无空隙安装和优异的焊料接合性能。该方法包括:安装步骤,通过底部填充膜将多个具有焊头电极的半导体芯片安装到具有与焊头电极相对的对电极的电子元件上;以及压缩接合步骤,通过底部填充膜将多个半导体芯片共同接合到电子元件上。底部填充膜包含环氧树脂、酸酐、丙烯酸树脂和有机过氧化物,其最低熔融粘度为 1,000 至 2,000 Pa*s,从高于最低熔融粘度达到温度 10°C 的温度到高于该温度 10°C 的温度之间的熔融粘度梯度为 900 至 3,100 Pa*s/°C。
  • Coating composition
    申请人:——
    公开号:US20040106742A1
    公开(公告)日:2004-06-03
    A coating composition comprising at least one polymer having carboxyl group, a polyfunctional epoxide-group-containing compound having at least one benzene or 5-, 6-, or 7-membered heterocyclic ring containing at least one heteroatom selected from nitrogen, oxygen or sulfur or cyclohexyl group or combinations thereof, and two or more epoxy groups, a reaction accelerator, and a solvent. This coating composition is excellent in storage stability, and can provide an excellent protective film.
    一种涂料组合物,包含至少一种具有羧基的聚合物、一种含多官能团环氧基的化合物(该化合物具有至少一个苯环或 5、6 或 7 元杂环,其中含有至少一个选自氮、氧或硫的杂原子或环己基或它们的组合)以及两个或多个环氧基、一种反应促进剂和一种溶剂。这种涂料组合物具有出色的储存稳定性,并能提供出色的保护膜。
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