2-methyl-1,4-phenylene bis(4-methylbenzoate)

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 缩酚酸和缩酚酸环醚类
• 英文名称: 2-methyl-1,4-phenylene bis(4-methylbenzoate)
• 英文别名: [3-Methyl-4-(4-methylbenzoyl)oxyphenyl] 4-methylbenzoate
• 化学式: C₂₃H₂₀O₄
• 分子量: 360.409
• InChiKey: WCYQDLFJFOPEES-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.8
• 重原子数：
  27
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.13
• 拓扑面积：
  52.6
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为产物：
  描述：

  对苄基三氟甲磺酸 、 benzene-1,3,5-triyl triformate 、 甲基苯醌 在 1,1'-双(二苯基膦)二茂铁 、 水 、 palladium diacetate 、 potassium carbonate 作用下， 以 甲苯 为溶剂， 反应 24.0h， 以56%的产率得到2-methyl-1,4-phenylene bis(4-methylbenzoate)
  参考文献：
  名称：

  钯催化羰基合成对苯醌和芳基三氟甲磺酸酯芳基酯

  摘要：

  已经开发了对苯醌与芳基三氟甲磺酸酯的钯催化二羰基化反应。使用 Cr(CO) 6作为 CO 源，该反应顺利且高效地进行，以中等至良好的收率（高达 90%）得到一系列芳基酯。

  DOI：

  10.1039/d1ob01400e

文献信息

• COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE
  申请人：JNC Corporation

  公开号：EP3141589A1

  公开（公告）日：2017-03-15

  The invention of the present application refers to a composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.

  本申请的发明涉及一种能够形成具有高导热性的散热部件的组合物和一种散热部件。本申请的热耗散构件组合物包含一种可聚合液晶化合物，其两端具有包括环氧乙烷基团或环氧乙烷基团的结构；一种固化剂，用于固化可聚合液晶化合物；以及一种由氮化物形成的无机填料。用于热耗散部件的组合物的固化温度在可聚合液晶化合物呈现液晶相的温度范围内或高于该温度范围，并且在可聚合液晶化合物呈现各向同性相的温度范围内或低于该温度范围。由于液晶化合物的排列与氮化物形成的无机填料之间的协同效应，由这种组合物形成的散热部件可以具有极佳的导热性。
• COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, ELECTRONIC DEVICE, AND HEAT-DISSIPATION-MEMBER PRODUCTION METHOD
  申请人：JNC Corporation

  公开号：EP3211018A1

  公开（公告）日：2017-08-30

  The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

  本发明涉及一种能够形成具有高导热性的散热部件和散热部件的组合物。本发明的散热部件组合物是一种用于散热部件的组合物，它包括与耦合剂一端粘合的具有热传导性的第一种无机填料；具有热传导性的第二种无机填料，该填料与偶联剂的一端粘合，其中双官能团或更高的可聚合化合物另外与粘合偶联剂的另一端粘合；其中与第一种无机填料粘合的偶联剂的另一端在固化过程中与第二种无机填料上的可聚合化合物粘合。
• LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE
  申请人：JNC Corporation

  公开号：EP3424702A1

  公开（公告）日：2019-01-09

  The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.

  本发明是一种层压板：通过它可以将半导体元件或类似元件内部不同材料界面处的热膨胀系数差异保持在很小的范围内；具有高耐热性；以及高导热性。这种层压板具有至少两层热膨胀控制部件，热膨胀控制部件包括与第一耦合剂的一端连接的导热第一无机填料，以及与第二耦合剂的一端连接的导热第二无机填料；第一耦合剂的另一端和第二耦合剂的另一端分别与可聚合化合物连接，或相互连接；热膨胀控制部件的热膨胀系数分别不同。
• COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, DEVICE HAVING THERMAL CONDUCTION LAYER, AND METHOD OF PRODUCING THERMALLY CONDUCTIVE MATERIAL
  申请人：Fujifilm Corporation

  公开号：EP3733730A1

  公开（公告）日：2020-11-04

  A first object of the present invention is to provide a composition capable of forming a cured product (thermally conductive material) having excellent thermal conductivity. In addition, a second object of the present invention is to provide a thermally conductive material formed from the composition and a device with a thermally conductive layer. In addition, a third object of the present invention is to provide a method for manufacturing a thermally conductive material using the composition. The composition of the present invention includes a curing agent including an active hydrogen-containing functional group, and a main agent including a reactive group which reacts with the active hydrogen-containing functional group, in which the main agent and the curing agent respectively exhibit liquid crystallinity in a single state at a temperature of 150°C or lower.

  本发明的第一个目的是提供一种能够形成具有优异导热性的固化产品（导热材料）的组合物。此外，本发明的第二个目的是提供一种由该组合物形成的导热材料和一种带有导热层的装置。此外，本发明的第三个目的是提供一种使用该组合物制造导热材料的方法。 本发明的组合物包括含活性含氢官能团的固化剂和含与活性含氢官能团反应的活性基团的主剂，其中主剂和固化剂在 150°C 或更低的温度下分别表现出单一状态下的液态结晶性。
• Composition for heat-dissipation members, heat-dissipation member, electronic device, and method of producing heat dissipating member
  申请人：JNC CORPORATION

  公开号：US10202530B2

  公开（公告）日：2019-02-12

  The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.

  本发明涉及一种能够形成具有高导热性的散热构件和散热构件的组合物。本发明的散热部件组合物是一种用于散热部件的组合物，它包括与耦合剂一端粘合的具有热传导性的第一种无机填料；具有热传导性的第二种无机填料，该填料与偶联剂的一端粘合，其中双官能团或更高的可聚合化合物另外与粘合偶联剂的另一端粘合；其中与第一种无机填料粘合的偶联剂的另一端在固化过程中与第二种无机填料上的可聚合化合物粘合。