A method for depositing a Si-containing film by plasma CVD is provided, and this method uses a silane compound as a film source. The silane compound has hydrogen atom or an alkoxy group as a reactive group, and has at least 2 silicon atoms in the molecule. The at least 2 silicon atoms are bonded by an intervening saturated hydrocarbon group. The ratio of the number of carbon atoms other than those included in the alkoxy group [C] to the number of silicon atoms [Si] ([C]/[Si]) is at least 3, and all silicon atoms are directly bonded to at least 2 carbon atoms. This method has realized an effective film deposition rate. Chemical stability of the film has also been improved by providing hydrophobicity with the film simultaneously with the suppression of the reactivity of the silicon atom for the nucleophilic reaction.
提供了一种通过等离子CVD沉积含Si薄膜的方法,该方法使用
硅烷化合物作为薄膜源。
硅烷化合物具有氢原子或烷氧基作为反应基团,并且分子中至少有2个
硅原子。至少2个
硅原子由介于饱和碳氢基团之间的键结合。除烷氧基所包含的碳原子外的碳原子数[C]与
硅原子数[Si]的比率([C]/[Si])至少为3,并且所有
硅原子直接与至少2个碳原子键合。该方法实现了有效的薄膜沉积速率。同时,通过抑制
硅原子对亲核反应的反应性,为薄膜提供了疏
水性,从而提高了薄膜的
化学稳定性。