INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION
申请人:Ono Kazuo
公开号:US20100179250A1
公开(公告)日:2010-07-15
It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors.
It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B).
(A) an epoxy resin,
(B) a clathrate complex comprising
(b1) an aromatic carboxylic acid compound, and
(b2) at least one imidazole compound represented by formula (II)
(wherein R
2
represents a hydrogen atom, etc.; R
3
to R
5
represent a hydrogen atom, etc.).
这是为了改善密封剂的储存稳定性,保持密封时密封剂的流动性,并通过加热实现密封剂的有效固化速率,以适用于精细半导体的密封剂。它是一种用于密封半导体的环氧树脂组合物,包括以下组分(A)和组分(B)。(A)环氧树脂,(B)包括(b1)芳香羧酸化合物和(b2)至少一种由式(II)表示的咪唑化合物的笼形复合物(其中R2表示氢原子等;R3至R5表示氢原子等)。