TIN COMPOUND, METHOD OF SYNTHESIZING THE SAME, TIN PRECURSOR COMPOUND FOR ATOMIC LAYER DEPOSITION, AND METHOD OF FORMING TIN-CONTAINING MATERIAL FILM
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US20180155372A1
公开(公告)日:2018-06-07
A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I):
wherein R
1
, R
2
, Q
1
, Q
2
, Q
3
, and Q
4
are each independently a Cl to C4 linear or branched alkyl group.
一种锡化合物,用于原子层沉积(ALD)的锡前体化合物,一种形成含锡材料薄膜的方法,以及一种合成锡化合物的方法,其中锡化合物由化学式(I)表示:其中R1、R2、Q1、Q2、Q3和Q4分别独立地是Cl至C4的直链或支链烷基基团。