2-Methylpiperidin-1-ium;bromide

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 哌啶类
• 英文名称: 2-Methylpiperidin-1-ium;bromide
• 英文别名: 2-methylpiperidin-1-ium;bromide
• 化学式: C6H14BrN
• 分子量: 180.09
• InChiKey: VKFVNDAWCWWBMG-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.73
• 重原子数：
  8
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  12
• 氢给体数：
  2
• 氢受体数：
  1

文献信息

• FLUX AND SOLDER PASTE
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP4063060A1

  公开（公告）日：2022-09-28

  Provided are flux in which solder wettability is improved, and a solder paste in which the flux is used. The flux contains 0.5-20.0 wt% of a (2-carboxyalkyl)isocyanurate adduct, and 5.0-45.0 wt% of a rosin, and furthermore contains a solvent. The (2-carboxyalkyl)isocyanurate adduct is a mono(2-carboxyalkyl)isocyanurate adduct, a bis(2-carboxyalkyl)isocyanurate adduct, a tris(2-carboxyalkyl)isocyanurate adduct, or a combination of two or more of these.

  本文提供了可改善焊料润湿性的助焊剂，以及使用该助焊剂的焊膏。该助焊剂含有 0.5-20.0 wt%的（2-羧基烷基）异氰尿酸酯加合物和 5.0-45.0 wt%的松香，还含有一种溶剂。(2-羧基烷基)异氰尿酸酯加合物是单(2-羧基烷基)异氰尿酸酯加合物、双(2-羧基烷基)异氰尿酸酯加合物、三(2-羧基烷基)异氰尿酸酯加合物或其中两种或两种以上的组合。
• Flux and resin composition for flux
  申请人：SENJU METAL INDUSTRY CO., LTD.

  公开号：US10556299B2

  公开（公告）日：2020-02-11

  An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.

  本发明的目的是提供一种在焊接时可抑制桥和球发生的助焊剂，以及一种用于该助焊剂的树脂组合物。 该助焊剂包括：至少一种选自 0.3 至 2.0 质量％的有机氯化合物，以及大于 0.04 质量％和 1.00 质量％或更少的胺盐酸盐；和 0.2 至 1.5 质量％的有机磷化合物，至少选自膦酸酯和苯基取代膦酸中的一种，每种都以整个助熔剂为基础。
• Flux and solder paste
  申请人：SENJU METAL INDUSTRY CO., LTD.

  公开号：US10987764B2

  公开（公告）日：2021-04-27

  It is an object of the present invention to provide a flux containing flux components homogeneously dispersed without precipitation of aggregates in addition to having an appropriate balance between fluidity and shape retention property, and a solder paste. A flux comprising 0.5 to 3.5 mass % of a sorbitol-type thixotropic agent selected from the group consisting of dibenzylidene sorbitol, bis(4-methylbenzylidene)sorbitol and a combination thereof, and 2 to 350 mass ppm of a sorbitol-type additive selected from the group consisting of sorbitol, monobenzylidene sorbitol, mono(4-methylbenzylidene)sorbitol and a combination thereof, and a glycol ether-type solvent.

  本发明的目的是提供一种助焊剂，其中的助焊剂成分不仅在流动性和形状保持性能之间取得适当平衡，而且分散均匀，不会析出团聚体。助焊剂包含 0.5 至 3.5 质量％的山梨醇型触变剂，该触变剂选自二亚苄基山梨醇、双(4-甲基亚苄基)山梨醇及其组合，以及 2 至 350 质量 ppm 的山梨醇型添加剂，该添加剂选自山梨醇、单亚苄基山梨醇、单(4-甲基亚苄基)山梨醇及其组合，以及乙二醇醚类溶剂。
• FLUX AND RESIN COMPOSITION FOR FLUX
  申请人：Senju Metal Industry Co., Ltd.

  公开号：EP3698913B1

  公开（公告）日：2022-01-19