名称:
Cleavage of SiC and GeC bonds in heterylsilanes and -germanes by organolithium reagents
摘要:
Organolithium reagents RLi can cleave Si-C and Ge-C bonds in heterylsilanes and -germanes substituting furyl, dihydrofuryl and dihydropyranyl groups for the organolithium residue R.
DOI:
10.1016/0022-328x(92)80169-x