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| 1254485-70-5

中文名称
——
中文别名
——
英文名称
——
英文别名
——
化学式
CAS
1254485-70-5
化学式
C12H26N4NiO2
mdl
——
分子量
317.054
InChiKey
RJSWBNAVXWCPAB-UHFFFAOYSA-L
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    None
  • 重原子数:
    None
  • 可旋转键数:
    None
  • 环数:
    None
  • sp3杂化的碳原子比例:
    None
  • 拓扑面积:
    None
  • 氢给体数:
    None
  • 氢受体数:
    None

反应信息

  • 作为产物:
    描述:
    NiCl2*2 acetonitrile 、 N',N'-dimethylisobutyrohydrazine 在 potassium hydride 作用下, 以 四氢呋喃 为溶剂, 反应 30.0h, 以62%的产率得到
    参考文献:
    名称:
    Exceptional thermal stability and high volatility in mid to late first row transition metal complexes containing carbohydrazide ligands
    摘要:
    Treatment of metal(II) halides (metal = Cu, Ni, Co, Fe, Mn, Cr) with the potassium salts of carbohydrazides L-1-L-6 afforded Cu(L-1)(2) (75%), Cu(L-2)(2) (51%), Cu(L-3)(2) (23%), Co(L-1)(2) (57%), Cr(L-1)(2) (62%), Ni(L-1)(2) (76%), Ni(L-2)(2) (62%), Ni(L-3)(2) (62%), Ni(L-4)(2) (13%), Ni(L-5)(2) (11%), Ni(L-6)(2) (29%), [Fe(L-1)(2)](2) (28%), and [Mn(L-1)(2)](2) (12%) as crystalline solids, where L-1 = Me2NN=C(tBu)O-, L-2 = Me2NN=C(iPr)O-, L-3 = Me2NN=C(Me)O-, L-4 = (CH2)(5)NN=C(tBu)O-, L-5 = (CH2)(5)NN=C(iPr)O-, and L-6 = (CH2)(5)NN=C(Me)O-. These complexes were characterized by spectral and analytical techniques, and by X-ray crystal structure determinations for Cu(L-1)(2), Co(L-1)(2), Cr(L-1)(2), Ni(L-1)(2), and Fe(L-1)(2)](2). Cu(L-1)(2), Co(L-1)(2), Cr(L-1)(2), and Ni(L-1)(2) exist as square planar, monomeric complexes, whereas [Fe(L1)2]2 is a dimer. A combination of sublimation studies, thermal decomposition temperature determinations, and thermogravimetric/differential thermal analysis demonstrate that the Cu, Co, and Ni complexes Cu(L-1)(2), Cu(L-2)(2), Co(L-1)(2), Ni(L-1)(2), and Ni(L-2)(2) have the lowest sublimation temperatures and highest decomposition temperatures among the series. Additionally, these compounds have higher volatilities and thermal stabilities than commonly used ALD and CVD precursors. Hence, these new complexes have excellent properties for application as ALD precursors to Cu, Co, and Ni metal films. (C) 2012 Elsevier Ltd. All rights reserved.
    DOI:
    10.1016/j.poly.2012.07.034
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