| 1254485-71-6

• 分子结构分类: 有机化合物 - 有机盐 - 有机金属盐
• CAS: 1254485-71-6
• 化学式: C₁₄H₃₀CrN₄O₂
• 分子量: 338.414
• InChiKey: AMLDUWHNKYPXHB-UHFFFAOYSA-L

计算性质

• 辛醇/水分配系数(LogP)：
  None
• 重原子数：
  None
• 可旋转键数：
  None
• 环数：
  None
• sp3杂化的碳原子比例：
  None
• 拓扑面积：
  None
• 氢给体数：
  None
• 氢受体数：
  None

反应信息

• 作为产物：
  描述：

  chromium dichloride 、 N',N'-dimethylpivaloylhydrazine 在 potassium hydride 作用下， 以 四氢呋喃 为溶剂， 以62%的产率得到
  参考文献：
  名称：

  [EN] THERMALLY STABLE VOLATILE FILM PRECURSORS
  [FR] PRÉCURSEURS DE FILM MINCE VOLATILS ET THERMIQUEMENT STABLES

  摘要：

  提供了一种用原子层沉积法沉积薄膜的前体。该化合物的化学式为MxLy，其中M是金属，L是一种来自酰胺脲衍生配体或酰胺酸衍生配体的配体。还提供了一种使用这些前体形成薄膜的过程。

  公开号：

  WO2010132871A1

文献信息

• Exceptional thermal stability and high volatility in mid to late first row transition metal complexes containing carbohydrazide ligands
  作者：Mahesh C. Karunarathne、Thomas J. Knisley、Gabriel S. Tunstull、Mary Jane Heeg、Charles H. Winter

  DOI：10.1016/j.poly.2012.07.034

  日期：2013.3

  Treatment of metal(II) halides (metal = Cu, Ni, Co, Fe, Mn, Cr) with the potassium salts of carbohydrazides L-1-L-6 afforded Cu(L-1)(2) (75%), Cu(L-2)(2) (51%), Cu(L-3)(2) (23%), Co(L-1)(2) (57%), Cr(L-1)(2) (62%), Ni(L-1)(2) (76%), Ni(L-2)(2) (62%), Ni(L-3)(2) (62%), Ni(L-4)(2) (13%), Ni(L-5)(2) (11%), Ni(L-6)(2) (29%), [Fe(L-1)(2)](2) (28%), and [Mn(L-1)(2)](2) (12%) as crystalline solids, where L-1 = Me2NN=C(tBu)O-, L-2 = Me2NN=C(iPr)O-, L-3 = Me2NN=C(Me)O-, L-4 = (CH2)(5)NN=C(tBu)O-, L-5 = (CH2)(5)NN=C(iPr)O-, and L-6 = (CH2)(5)NN=C(Me)O-. These complexes were characterized by spectral and analytical techniques, and by X-ray crystal structure determinations for Cu(L-1)(2), Co(L-1)(2), Cr(L-1)(2), Ni(L-1)(2), and Fe(L-1)(2)](2). Cu(L-1)(2), Co(L-1)(2), Cr(L-1)(2), and Ni(L-1)(2) exist as square planar, monomeric complexes, whereas [Fe(L1)2]2 is a dimer. A combination of sublimation studies, thermal decomposition temperature determinations, and thermogravimetric/differential thermal analysis demonstrate that the Cu, Co, and Ni complexes Cu(L-1)(2), Cu(L-2)(2), Co(L-1)(2), Ni(L-1)(2), and Ni(L-2)(2) have the lowest sublimation temperatures and highest decomposition temperatures among the series. Additionally, these compounds have higher volatilities and thermal stabilities than commonly used ALD and CVD precursors. Hence, these new complexes have excellent properties for application as ALD precursors to Cu, Co, and Ni metal films. (C) 2012 Elsevier Ltd. All rights reserved.