CURABLE RESIN COMPOSITION, CURABLE RESIN MOLDED BODY, CURED RESIN MOLDED BODY, METHOD FOR PRODUCING EACH OF SAME, AND LAMINATE BODY
申请人:LINTEC CORPORATION
公开号:US20140350187A1
公开(公告)日:2014-11-27
Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140° C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.
GAS-BARRIER FILM, PROCESS FOR PRODUCING SAME, MEMBER FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
申请人:LINTEC Corporation
公开号:EP2620278A9
公开(公告)日:2014-10-29
The present invention provides a gas barrier film including a base layer, and a gas barrier layer that is provided on at least one side of the base layer, the base layer including a resin having a glass transition temperature (Tg) of more than 130°C, the gas barrier layer being formed of a material that includes at least an oxygen atom and a silicon atom, a surface layer part of the gas barrier layer having an oxygen atom content rate of 60 to 75%, a nitrogen atom content rate of 0 to 10%, and a silicon atom content rate of 25 to 35%, based on a total content rate of oxygen atoms, nitrogen atoms, and silicon atoms, and the surface layer part of the gas barrier layer having a film density of 2.4 to 4.0 g/cm3. Also provided are a process for producing the same, an electronic device member that includes the gas barrier film, and an electronic device that includes the electronic device member. The gas barrier film of the invention exhibits an excellent gas barrier capability, excellent transparency, excellent bending resistance, and excellent heat resistance.
GAS BARRIER FILM, METHOD FOR PRODUCING SAME, GAS BARRIER FILM LAMINATE, MEMBER FOR ELECTRONIC DEVICES, AND ELECTRONIC DEVICE
申请人:Lintec Corporation
公开号:EP2774755A1
公开(公告)日:2014-09-10
The present invention provides: a gas barrier film comprising a cured resin layer and a gas barrier layer, the gas barrier layer being provided on at least one side of the cured resin layer,
the cured resin layer being a layer formed of a cured product of a curable resin composition that includes (A) a thermoplastic resin having a glass transition temperature (Tg) of 140°C or more, and (B) a curable monomer,
the gas barrier film having a water vapor transmission rate of 1 g/m2/day or less at a temperature of 40°C and a relative humidity of 90%; a method for producing the gas barrier film; a gas barrier film laminate comprising the gas barrier film; an electronic device member comprising the gas barrier film; an electronic device member comprising the gas barrier film laminate; an electronic device comprising the electronic device member.
Since the gas barrier film and the gas barrier film laminate of the present invention exhibits excellent heat resistance, excellent solvent resistance, excellent interlayer adhesion, and an excellent gas barrier capability, has a low birefringence, and exhibits excellent optical isotropy, the gas barrier film and the gas barrier film laminate may suitably be used as an electronic device member.
Provided is a gas barrier laminate which, even when produced by a coating method, has a reduced thickness, excellent optical isotropy, and excellent gas barrier property, and can be suitably used as a member for an electronic device, the gas barrier laminate including, a process film, a base layer, and a gas barrier layer, in this order, the base layer being a layer formed of a cured product of a curable resin composition containing a polymer component (A), and a curable monomer (B), the polymer component (A) having the glass transition temperature of 250°C or higher.