POSITIVE PHOTOSENSITIVE RESIN PRECURSOR COMPOSITION AND PROCESS FOR PRODUCING THE SAME
申请人:TORAY INDUSTRIES, INC.
公开号:EP1037112A1
公开(公告)日:2000-09-20
The present invention relates to a positive-working photosensitive resin precursor composition which is characterized in that it contains (a) polymer in which the chief component comprises structural units of the kind where the bonding between structural units is represented by general formula (1) and (b) photoacid generator, and it can form a pattern by light irradiation and subsequent developing, and the total carboxyl groups contained in said polymer is from 0.02 to 2.0 mmol/g, and it provides a photosensitive resin composition of high sensitivity which can be developed by alkali.
(R1 is an organic group of valency from 3 to 8 having at least 2 carbon atoms, R2 is an organic group of valency from 2 to 6 having at least 2 carbon atoms, R3 is hydrogen or an organic group with from 1 to 20 carbons. n is an integer of value from 3 to 100,000, m is 1 or 2, p and q are integers of value from 0 to 4 and p + q > 0.)
本发明涉及一种积极工作的光敏树脂前体组合物,其特征在于它含有(a)聚合物,其中主要成分由结构单元组成,结构单元之间的键合由通式(1)表示;(b)光酸发生剂,它可以通过光照射和随后的显影形成图案,所述聚合物中所含的羧基总量为0.02至2.0毫摩尔/克,它提供了一种可以用碱显影的高灵敏度的光敏树脂组合物。
(R1是具有至少 2 个碳原子的价数为 3 至 8 的有机基团,R2是具有至少 2 个碳原子的价数为 2 至 6 的有机基团,R3 是氢或具有 1 至 20 个碳原子的有机基团。n 是值为 3 至 100,000 的整数,m 是 1 或 2,p 和 q 是值为 0 至 4 的整数,p + q > 0)。