Synthesis of alkyl dithiocarbamates by using thiuram disulfide reagents: A metal-free C(sp3)-S bond formation
作者:Yu Cheng、Han-Ying Peng、Zhi-Bing Dong
DOI:10.1016/j.tetlet.2019.01.044
日期:2019.2
An efficient and environmentally benign protocol for the synthesis of S-alkyl dithiocarbamates has been achieved. By reacting tetraalkylthiuram disulfides with alkyl halides, the desired products could be obtained in good to excellent yields. The methodology features efficiency, transition-metal-free, nice yields and easy performance, illustrating it practical synthetic value for the convenient preparation
A New Synthesis of Thioamides and Dithiocarbamates from Organolithium Derivatives
作者:S. Gronowitz、A. -B. Hörnfeldt、M. Temciuc
DOI:10.1055/s-1993-25888
日期:——
The reaction of organolithium derivatives with thiuram monosulfides gives a convenient method for the synthesis of both aromatic and aliphatic thioamides in good yields. In our hands, the reaction of organolithium derivatives with tetramethylthiuram disulfide gave only dithiocarbamates and not a mixture of these and thioamides.
A process for producing a shaped product, which comprises polymerizing a mixture comprising an iniferter and a radical polymerizable monomer to obtain a half polymer having a rate of polymerization of from 5 to 90 wt%, filling the half polymer in a predetermined cavity and then applying a polymerization energy again to the half polymer to complete polymerization.
Cured film formed by curing photosensitive resin composition and method for manufacturing same
申请人:TORAY INDUSTRIES, INC.
公开号:US10545406B2
公开(公告)日:2020-01-28
Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.