Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.
本发明提供了一种对
金属
铜具有高延伸率、低应力和高附着力的固化薄膜。该固化膜是通过固化感光
树脂组合物形成的,其中感光
树脂包括聚羟酰胺,固化膜中聚羟酰胺的环闭率不超过 10%。