(4-Ethyl-4,5-dihydrooxazol-4-yl)methanol | 57101-67-4

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 唑啉类
• 英文名称: (4-Ethyl-4,5-dihydrooxazol-4-yl)methanol
• 英文别名: (4-ethyl-5H-1,3-oxazol-4-yl)methanol
• CAS: 57101-67-4
• 化学式: C₆H₁₁NO₂
• 分子量: 129.16
• InChiKey: GJQYUBSDVFSWFJ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.1
• 重原子数：
  9
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.83
• 拓扑面积：
  41.8
• 氢给体数：
  1
• 氢受体数：
  3

文献信息

• Multifunctional water-dispersible crosslink agents
  申请人：Stahl Holland B.V.

  公开号：EP0507407A1

  公开（公告）日：1992-10-07

  The invention describes a new type of multi-functional water-dispersible crosslinking agents. These crosslinking agents are products consisting of oligomeric and compounds containing carbodiimide functions and other reactive functional groups. Further the invention describes aqueous dispersions, emulsions or solutions with such crosslinking agents. Finally the invention comprises a process for the preparation of the crosslinking agent according to the invention.

  本发明描述了一种新型多功能水分散性交联剂。这些交联剂是由含有碳二亚胺官能团和其他活性官能团的低聚物和化合物组成的产品。此外，本发明还描述了含有此类交联剂的水性分散体、乳液或溶液。最后，本发明还包括根据本发明制备交联剂的工艺。
• POLYISOCYANAT-BASIERTE POLYADDITIONSVERBINDUNGEN MIT FÜNFGLIEDRIGEN CYCLISCHEN IMINOETHER-STRUKTURELEMENTEN ZUR HERSTELLUNG VON POLYURETHAN KUNSTSTOFFEN
  申请人：Covestro Deutschland AG

  公开号：EP3885388A1

  公开（公告）日：2021-09-29

  Die vorliegende Erfindung betrifft die Verwendung Polyisocyanat-basierter Polyadditionsverbindungen mit fünfgliedrigen cyclischen Iminoether-Strukturelementen zur Herstellung von Polyurethankunststoffen. Außerdem betrifft die Erfindung Beschichtungsmittel enthaltend die Polyisocyanat-basierten Polyadditionsverbindungen, sowie entsprechend beschichtete Substrate.

  本发明涉及使用具有五元环亚氨基醚结构单元的聚异氰酸酯基多加成化合物生产聚氨酯塑料。本发明还涉及含有聚异氰酸酯基多加成化合物的涂层组合物以及相应的涂层基材。
• POLISHING FLUIDS AND METHODS FOR CMP
  申请人：3M Innovative Properties Company

  公开号：EP1951837A1

  公开（公告）日：2008-08-06
• Polishing fluids and methods for CMP
  申请人：Kollodge S. Jeffrey

  公开号：US20070093182A1

  公开（公告）日：2007-04-26

  Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.
• Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor
  申请人：AIR PRODUCTS AND CHEMICALS, INC.

  公开号：US20160122590A1

  公开（公告）日：2016-05-05

  Slurries and associated methods and systems for the chemical mechanical planarization (CMP) of tungsten-containing films on semiconductor wafers are described. The slurries comprise abrasive particles, activator-containing particles, peroxygen oxidizer, pH adjustor, and the remaining being water. The slurries have a pH in the range of 4 to 10; preferably 5 to 9; more preferably 6 to 8.