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Cinnamido benzylpiperidinyl ethoxypropylbenzamide | 1382749-08-7

中文名称
——
中文别名
——
英文名称
Cinnamido benzylpiperidinyl ethoxypropylbenzamide
英文别名
2-(4-benzylpiperidin-1-yl)-N-(3-ethoxypropyl)-5-[[(E)-3-phenylprop-2-enoyl]amino]benzamide
Cinnamido benzylpiperidinyl ethoxypropylbenzamide化学式
CAS
1382749-08-7
化学式
C33H39N3O3
mdl
——
分子量
525.7
InChiKey
WLBVNLFUCUVTLE-SAPNQHFASA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    5.9
  • 重原子数:
    39
  • 可旋转键数:
    12
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.33
  • 拓扑面积:
    70.7
  • 氢给体数:
    2
  • 氢受体数:
    4

文献信息

  • METHOD OF TREATING SKIN WITH microRNA MODULATORS
    申请人:Avon Products, Inc.
    公开号:EP2658537A1
    公开(公告)日:2013-11-06
  • Method of Treating Skin with microRNA Modulators
    申请人:Khusial Permanan Raaj
    公开号:US20120165373A1
    公开(公告)日:2012-06-28
    Methods for preventing, ameliorating, or reducing dermatological signs of aging are provided which employ active agents that suppress or down-regulate microRNA expression in dermal fibroblast, resulting in enhanced production of collagen, elastin and/or fibrillin in the skin. Also provided are methods for screening for activity against specific microRNAs and the methods of using active agents identified by the screening protocol in the treatment of skin.
  • Modulation of Thymosin Beta-4 in Skin
    申请人:Chen Siming
    公开号:US20130149397A1
    公开(公告)日:2013-06-13
    Methods for preventing, ameliorating, or reducing dermatological signs of aging are provided which employ active agents, other than a retinoid, that stimulate thymosin beta-4 expression in the skin. Also provided are methods for screening for substances which stimulate thymosin beta-4 expression levels and the methods of using active agents identified by the screening protocol in the treatment of skin.
  • US8455518B2
    申请人:——
    公开号:US8455518B2
    公开(公告)日:2013-06-04
  • US8632827B2
    申请人:——
    公开号:US8632827B2
    公开(公告)日:2014-01-21
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