1,4-Bisbenzol | 18066-45-0

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 1,4-Bisbenzol
• 英文别名: 1,4-di[bis(4'-hydroxyphenyl)methyl]benzene；4-[[4-[Bis(4-hydroxyphenyl)methyl]phenyl]-(4-hydroxyphenyl)methyl]phenol
• CAS: 18066-45-0
• 化学式: C₃₂H₂₆O₄
• 分子量: 474.556
• InChiKey: WEUGALIEZARHOK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  7.3
• 重原子数：
  36
• 可旋转键数：
  6
• 环数：
  5.0
• sp3杂化的碳原子比例：
  0.06
• 拓扑面积：
  80.9
• 氢给体数：
  4
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  1,4-Bisbenzol 在 吡啶 、 potassium carbonate 、 copper(l) chloride 、 copper dichloride 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 120.0h， 生成 TIMEOUT: 5s
  参考文献：
  名称：

  Berscheid, Ralf; Nieger, Martin; Voegtle, Fritz, Chemische Berichte, 1992, vol. 125, # 7, p. 1687 - 1696

  摘要：

  DOI：
• 作为产物：
  描述：

  1,4-bis[bis(4-methoxyphenyl)hydroxymethyl]benzene 在 乙硫醇钠 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 48.0h， 以48%的产率得到1,4-Bisbenzol
  参考文献：
  名称：

  Berscheid, Ralf; Nieger, Martin; Voegtle, Fritz, Chemische Berichte, 1992, vol. 125, # 7, p. 1687 - 1696

  摘要：

  DOI：

文献信息

• Optically active compound and photosensitive resin composition
  申请人：——

  公开号：US20030211421A1

  公开（公告）日：2003-11-13

  A photoactive compound is used in combination with a photosensitizer, represented by the following formula (1): A −[( J ) m −( X-Pro )] n (1) wherein A represents a hydrophobic unit comprising at least one kind of hydrophobic groups selected from a hydrocarbon group and a heterocyclic group, J represents a connecting group, X-Pro represents a hydrophilic group protected by a protective group Pro which is removable by light exposure, m represents 0 or 1, and n represents an integer of not less than 1. The protective group Pro may be removable by light exposure in association with the photosensitizer (especially, a photo acid generator), or may be a hydrophobic protective group. The hydrophilic group may be a hydroxyl group or a carboxyl group. The photoactive compound has high sensitivity to a light source of short wavelength beams, for resist application, therefore, the photoactive compound is advantageously used for forming a pattern with high resolution.

  一种光活性化合物与光敏剂结合使用，由以下公式（1）表示： A −[( J ) m −( X-Pro )] n (1) 其中，A代表至少包括一种从烃基和杂环基中选择的疏水基的疏水单元，J代表连接基团，X-Pro代表由光照可去除的保护基团Pro保护的亲水基团，m代表0或1，n代表不少于1的整数。 保护基团Pro可以与光敏剂（特别是光酸发生剂）一起通过光照可去除，也可以是疏水保护基团。亲水基团可以是羟基或羧基。光活性化合物对短波长光源具有很高的敏感性，用于光刻应用，因此，该光活性化合物有利于形成具有高分辨率的图案。
• NOVEL TETRACARBOXYLIC DIANHYDRIDE, POLYIMIDE RESIN AND METHOD FOR PRODUCING THE SAME, PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20190169211A1

  公开（公告）日：2019-06-06

  The present invention has been made in view of the circumstances herein. An object of the present invention is to provide: a tetracarboxylic dianhydride which can lead to a polyimide usable as a base resin of a photosensitive resin composition capable of forming a fine pattern and obtaining high resolution without impairing excellent characteristics such as mechanical strength and adhesiveness; a polyimide resin obtained by using the tetracarboxylic dianhydride; and a method for producing the polyimide resin. The tetracarboxylic dianhydride is shown by the following general formula (1).

  本发明是基于本文中的情况而作出的。本发明的目的是提供：一种四羧酸二酐，可导致聚酰亚胺，作为感光树脂组合物的基树脂，能够形成细微图案并获得高分辨率，同时不损害优异的特性，如机械强度和粘附性；通过使用该四羧酸二酐获得的聚酰亚胺树脂；以及生产该聚酰亚胺树脂的方法。该四羧酸二酐由以下通用式（1）所示。
• Organic Silicon-Based Compound And Method Of Producing The Same
  申请人：Kikuchi Taketoshi

  公开号：US20070203275A1

  公开（公告）日：2007-08-30

  Provided are an organic silicon compound of the following formula (I): (wherein, R 1 to R 20 represent each independently alkyl, alkoxy, aryloxy, cycloalkyl, alkylcycloalkyl, aryl, dialkylamino or the like, and the aryloxy and aryl may be substituted with a substituent selected from the group consisting of alkyl, alkoxy and alkoxyalkyl.) which can be used for suppression of coloration and thermal deterioration of an organic material in molding, and an organic material composition containing the organic silicon compound and a method of producing the organic silicon compound.

  提供以下式(I)的有机硅化合物：（其中，R1到R20分别独立表示烷基、烷氧基、芳氧基、环烷基、烷基环烷基、芳基、二烷基氨基或类似物，芳氧基和芳基可被从烷基、烷氧基和烷氧基中选择的取代基所取代。）该化合物可用于抑制有机材料在成型过程中的着色和热降解，以及含有该有机硅化合物的有机材料组合物和生产该有机硅化合物的方法。
• COMPOUND FOR FORMING ORGANIC FILM, COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FILM, AND PATTERNING PROCESS
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20170184968A1

  公开（公告）日：2017-06-29

  A compound for forming an organic film shown by the formula (1A), R—(—X) m1 (1A) wherein R represents a single bond or an organic group having 1 to 50 carbon atoms; X represents a group shown by formula (1B); and ml represents an integer satisfying 2≦m1≦10, wherein X 2 represents a divalent organic group having 1 to 10 carbon atoms; n1 represents 0 or 1; n2 represents 1 or 2; X 3 represents a group shown by the formula (1C); and n5 represents 0, 1, or 2, wherein R 10 represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 10 carbon atoms, wherein a hydrogen atom of the benzene ring in formula (1C) may be substituted with a methyl group or methoxy group. This compound for forming an organic film can provide organic film composition having good dry etching resistance, heat resistance to 400° C. or higher, high filling and planarizing properties.

  一种用于形成有机薄膜的化合物，其化学式为(1A)，R—(—X)m1(1A)，其中R代表一个单键或具有1至50个碳原子的有机基团；X代表化学式(1B)所示的基团；m1代表满足2≦m1≦10的整数，其中X2代表具有1至10个碳原子的二价有机基团；n1代表0或1；n2代表1或2；X3代表化学式(1C)所示的基团；n5代表0、1或2，其中R10代表氢原子或具有1至10个碳原子的饱和或不饱和碳氢基团，化学式(1C)中苯环的氢原子可能被甲基基团或甲氧基取代。这种用于形成有机薄膜的化合物可以提供具有良好干法刻蚀抗性、耐高温至400°C或更高、高填充和平整化性能的有机薄膜组合物。
• Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminate
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US10197914B2

  公开（公告）日：2019-02-05

  The present invention provides a positive photosensitive resin composition containing (A) a polymer compound containing a siloxane chain, the polymer compound having a repeating unit shown by the general formula (1) and a weight average molecular weight of 3,000 to 500,000, (B) a photosensitive material capable of generating an acid by light and increasing a dissolution rate in an aqueous alkaline solution, (C) a crosslinking agent, and (D) a solvent. There can be provided a positive photosensitive resin composition that can remedy the problem of delamination caused on a metal wiring such as Cu and Al, an electrode, and a substrate, especially on a substrate such as SiN, and can form a fine pattern having a forward tapered shape without generating a scum and a footing profile in the pattern bottom and on the substrate when a widely used 2.38% TMAH aqueous solution is used as the developer.

  本发明提供了一种含有（A）含有硅氧烷链的聚合物化合物的阳性感光树脂组合物，该聚合物化合物具有由通式（1）所示的重复单元和重量平均分子量为3,000至500,000，（B）能够通过光生成酸并增加在水性碱性溶液中的溶解速率的感光材料，（C）交联剂和（D）溶剂。可以提供一种阳性感光树脂组合物，可以解决在金属线路（如Cu和Al）、电极和基板上引起的剥离问题，特别是在SiN等基板上，可以在使用广泛的2.38％TMAH水溶液作为显影剂时，在图案底部和基板上形成具有前向锥形形状的细微图案，而不会产生污点和底部轮廓。