Phenyl 2,6-dimethylpiperidine-1-carboxylate

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 哌啶类
• 英文名称: Phenyl 2,6-dimethylpiperidine-1-carboxylate
• 化学式: C₁₄H₁₉NO₂
• mdl: MFCD00585012
• 分子量: 233.31
• InChiKey: QDMSXEDLEZCGAY-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  17
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  29.5
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• PHENOLIC RESIN COMPOSITION, AND METHODS FOR MANUFACTURING CURED RELIEF PATTERN AND SEMICONDUCTOR
  申请人：Sasaki Takahiro

  公开号：US20130168829A1

  公开（公告）日：2013-07-04

  Provided is a photopolymer composition for a semiconductor element surface protective film or an interlayer insulating film, in which a solution of the photopolymer composition comprises 100 parts by mass of (A) a phenolic resin having a biphenyldiyl structure in a main chain of the resin; 1 to 30 parts by mass of (B) a photo acid-generating agent; and 1 to 60 parts by mass of (C) a compound that can be reacted with ingredient (A) by means of an acid generated from the photo acid-generating agent or heat.
• US9029270B2
  申请人：——

  公开号：US9029270B2

  公开（公告）日：2015-05-12