1-Ethyl-1-heptylpiperidin-1-ium

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 哌啶类
• 英文名称: 1-Ethyl-1-heptylpiperidin-1-ium
• 化学式: C14H30N+
• 分子量: 212.39
• InChiKey: NEHRNKRYGQRPBR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.4
• 重原子数：
  15
• 可旋转键数：
  7
• 环数：
  1.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

文献信息

• PRESSURE-SENSITIVE ADHESIVE FILM
  申请人：Hanaki Ikkou

  公开号：US20140079949A1

  公开（公告）日：2014-03-20

  A pressure-sensitive adhesive film including a substrate and a pressure-sensitive adhesive layer provided on at least one side of the substrate, wherein the pressure-sensitive adhesive layer contains a (meth)acryl-based polymer, an ionic liquid, and a crosslinking agent, and the pressure-sensitive adhesive layer contains 2 parts by weight or less of the crosslinking agent based on 100 parts by weight of the (meth)acryl-based polymer, the pressure-sensitive adhesive film having an adhesive strength of 0.5 N/25 mm or more as measured at a tension rate of 1.0 m/minute after it is placed on an adherend of an acrylic panel under the conditions of 23° C. and 50% RH for 30 minutes.

  一种压敏粘合膜，包括基材和压敏粘合层，该压敏粘合层位于基材的至少一侧，其中压敏粘合层包含一种（甲基）丙烯酸基聚合物、一种离子液体和一种交联剂，且压敏粘合层中交联剂的重量不超过（甲基）丙烯酸基聚合物重量的100份之2，该压敏粘合膜在23℃和50%相对湿度条件下放置于丙烯酸板的粘结面30分钟后，以1.0 m/分钟的张力速率测量，其粘接强度为0.5 N/25 mm或更高。
• Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film
  申请人：NITTO DENKO CORPORATION

  公开号：EP1602698A1

  公开（公告）日：2005-12-07

  The present invention provides a pressure-sensitive adhesive which can prevent electrification of a non-electrification-prevented adherend upon peeling, suppresses occurrence of peeling off even with time or via treatment under a high temperature, and is excellent in adhesion reliance, as well as an antistatic pressure-sensitive adhesive sheet, and surface protecting film using this. The pressure-sensitive adhesive composition of the present invention contains an ionic liquid, and a polymer having a glass transition temperature of Tg of 0°C or lower as a base polymer, as well as an ethylene oxide group-containing compound and/or a surfactant.

  本发明提供了一种在剥离时可防止非防静电粘合剂带电，即使经过一段时间或高温处理也可抑制剥离的发生，且粘合可靠性极佳的压敏粘合剂，以及使用该压敏粘合剂的防静电压敏胶片和表面保护膜。本发明的压敏胶组合物含有离子液体、玻璃化温度 Tg 为 0°C 或更低的聚合物作为基体聚合物，以及含环氧乙烷基团的化合物和/或表面活性剂。
• Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheets and surface protecting film
  申请人：NITTO DENKO CORPORATION

  公开号：EP1889889A2

  公开（公告）日：2008-02-20

  The present invention provides a pressure-sensitive composition comprising an ionic liquid and a polymer having a glass transition temperature Tg of 0°C or lower as a base polymer as a pressure-sensitive adhesive composition in which electrification of a pressure-sensitive adhesive sheet can be prevented upon peeling, and staining property on an adherend can be reduced, and an antistatic pressure-sensitive sheet and surface protecting film using the pressure-sensitive adhesive composition.

  本发明提供了一种压敏胶组合物，该组合物由离子液体和玻璃化转变温度 Tg 为 0°C 或更低的聚合物作为基础聚合物组成，作为压敏胶组合物，可以防止压敏胶片在剥离时发生电化，并减少粘附物上的沾污特性，还提供了使用该压敏胶组合物的抗静电压敏胶片和表面保护膜。
• Pressure-sensitive adhesive sheet and surface protective film
  申请人：Nitto Denko Corporation

  公开号：EP2484734A2

  公开（公告）日：2012-08-08

  A pressure-sensitive adhesive sheet 1 provided by the present invention is provided with a substrate film 12 comprising a transparent resin material, an antistatic layer 14 provided on a first side 12A thereof, and a pressure-sensitive adhesive layer 20 provided on a second side 12B thereof. The antistatic layer 14 contains an antistatic component (for example, an electroconductive polymer) and a binder resin, and has an average thickness Dave of 1 nm to less than 100 nm. The pressure-sensitive adhesive layer 20 contains an acrylic polymer as a base polymer and an ionic compound (such as an ionic liquid and alkaline metal salt) as an antistatic component.

  本发明提供的压敏胶片 1 具有由透明树脂材料构成的基底膜 12、设置在其第一面 12A 上的抗静电层 14 以及设置在其第二面 12B 上的压敏胶层 20。抗静电层 14 包含抗静电成分（例如导电聚合物）和粘合剂树脂，其平均厚度 Dave 为 1 纳米至小于 100 纳米。压敏粘合剂层 20 包含作为基础聚合物的丙烯酸聚合物和作为抗静电成分的离子化合物（例如离子液体和碱金属盐）。
• Pressure-sensitive adhesive tape for temporary fixing of electronic part
  申请人：Nitto Denko Corporation

  公开号：EP2500390A1

  公开（公告）日：2012-09-19

  In the production process of electronic parts, since a surface resistance value is too much increased after heat foaming of a pressure-sensitive adhesive layer, static electricity is easily accumulated in electronic parts, and the static electricity has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0 x 1013 Ω/□ or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.

  在电子零件的生产过程中，由于压敏胶层受热发泡后表面电阻值增加过多，电子零件中容易积聚静电，静电干扰了电子零件的性能。本发明的一种用于临时固定电子零件的压敏胶带解决了这一问题，该压敏胶带至少包括支撑基材薄膜和设置在基材一侧的热膨胀压敏胶层，其中热膨胀压敏胶层包含热膨胀微球和离子液体；离子液体的含量为 0.01 至 10 份（以 100 份（重量）热膨胀压敏胶层中所含聚合物的重量为基准）；热膨胀压敏胶层的表面电阻为 1.0 x 1013 Ω/□ 或更小；加热发泡后的表面电阻与加热前的表面电阻之比为 5.0 或更小。