N,N'''-乙烯二[1,3,5-三嗪-2,4,6-三胺] | 42445-78-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 中文名称: N,N'''-乙烯二[1,3,5-三嗪-2,4,6-三胺]
• 英文名称: N²,N^2'-(ethane-1,2-diyl)bis(1,3,5-triazine-2,4,6-triamine)
• 英文别名: N²,N^2'-ethanediyl-bis-[1,3,5]triazine-2,4,6-triyltriamine；N²,N^2'-Aethandiyl-bis-[1,3,5]triazin-2,4,6-triyltriamin；N,N'''-ethylenebis(1,3,5-triazine-2,4,6-triamine)；ethylenedimelamine；ethylenebismelamine；2-N-[2-[(4,6-diamino-1,3,5-triazin-2-yl)amino]ethyl]-1,3,5-triazine-2,4,6-triamine
• CAS: 42445-78-3
• 化学式: C₈H₁₄N₁₂
• 分子量: 278.28
• InChiKey: GVOXAHOKHXNNBX-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -1
• 重原子数：
  20
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  206
• 氢给体数：
  6
• 氢受体数：
  12

反应信息

• 作为反应物：
  描述：

  N,N'''-乙烯二[1,3,5-三嗪-2,4,6-三胺] 、 氰尿酸 生成 2-N-[2-[(4,6-diamino-1,3,5-triazin-2-yl)amino]ethyl]-1,3,5-triazine-2,4,6-triamine;1,3,5-triazinane-2,4,6-trione
  参考文献：
  名称：

  OKAMOTO, HIDEMASA;YAMANAKA, MITSUO;FUJII, KAZUYOSHI

  摘要：

  DOI：
• 作为产物：
  描述：

  2-氯-4,6-二氨基-1,3,5-三嗪 、 乙二胺 在 三乙胺 作用下， 以 水 为溶剂， 生成 N,N'''-乙烯二[1,3,5-三嗪-2,4,6-三胺]
  参考文献：
  名称：

  溶剂辅助固化形状可控的介孔三聚氰胺-甲醛聚合物

  摘要：

  我们报告了一种新策略，即溶剂辅助固化，用于将多孔网络开发成聚合物材料。无孔三聚氰胺甲醛聚合物在非质子溶剂中的简单热处理提供了具有异常高表面积的多孔特性，这是由于在溶剂的帮助下部分聚合物结构的溶胀和排除所致。多孔性能可以通过选择影响交联度的溶剂和单体比例来确定。此外，通过调整前体材料的形状，我们制备了多种形式的多孔聚合物，例如颗粒和整体。所得材料用于 CO 2吸附并被证明是一种潜在的气体吸附剂。这种通用方法可以与其他聚合物材料结合使用，并提供了一种扩大多孔材料范围的方法。

  DOI：

  10.1039/d1ta10921a

文献信息

• Compositions of matter having bioactive properties
  申请人：Schmitz, Robert A.

  公开号：EP1288238A1

  公开（公告）日：2003-03-05

  Particles of coordinated complex comprising a basic, hydrous polymer and a capacitance adding compound, as well as methods for their production, are described. These complexes exhibit a high degree of bioactivity making them suitable for a broad range of applications through their incorporation into conventional vehicles benefiting from antimicrobial and similar properties.

  描述了由基础水合聚合物和电容添加化合物组成的协调复合物的颗粒，以及它们的生产方法。这些复合物表现出很高的生物活性，使它们适用于广泛的应用领域，通过将它们纳入传统载体中，从而受益于抗菌和类似性能。
• Negative photosensitive composition and method for forming a resist
  申请人：Mitsubishi Kasei Corporation

  公开号：US05292614A1

  公开（公告）日：1994-03-08

  A negative photosensitive composition comprising an alkali-soluble resin, a photo-acid-generating material and a crosslinking agent for the alkali-soluble resin, which acts under an acidic condition, wherein the crosslinking agent is a compound of the following formula (I): ##STR1## wherein each of A.sup.1 to A.sup.10 which are independent of one another, is a hydrogen atom, --CH.sub.2 OH or --CH.sub.2 OR, wherein R is C.sub.1 -C.sub.4 linear or branched chain alkyl, and X is C.sub.2 -C.sub.10 linear or branched chain alkylene, provided that at least four among A.sup.1 to A.sup.10 are --CH.sub.2 OR, and a plurality of --CH.sub.2 OR may be the same or different.

  一种负性光敏组合物，包括碱溶性树脂、光酸发生剂和交联剂，用于碱溶性树脂的酸性条件下交联，其中交联剂是以下式(I)的化合物：##STR1## 其中，A.sup.1至A.sup.10各自独立地是氢原子、--CH.sub.2 OH或--CH.sub.2 OR，其中R为C.sub.1-C.sub.4线性或支链烷基，X为C.sub.2-C.sub.10线性或支链烷基，至少四个A.sup.1至A.sup.10是--CH.sub.2 OR，且多个--CH.sub.2 OR可以相同或不同。
• NON-HALOGEN FLAME-RETARDANT SYNTHETIC RESIN COMPOSITION
  申请人：Kaneda Takayoshi

  公开号：US20110092622A1

  公开（公告）日：2011-04-21

  The present invention is the non-halogen flame-retardant synthetic resin composition characterized in that the said synthetic resin contains the (poly)phosphate compounds represented by the general formulae (1) and (3), described in Claim 1 , and layered silicate; n in the general formula (1) represents a number of 1˜100, X 1 is ammonia, or a triazine derivative represented by the general formula (2) described in Claim 1 , p is a number satisfying the relational expression of 0

  本发明是一种非卤素阻燃合成树脂组合物，其特征在于所述的合成树脂包含在权利要求书中描述的通式(1)和(3)所代表的(聚)磷酸盐化合物以及层状硅酸盐；通式(1)中的n表示1~100的数字，X1为氨或权利要求书中描述的通式(2)所代表的三嗪衍生物，p为满足0
• EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD
  申请人：DIC Corporation

  公开号：US20150252136A1

  公开（公告）日：2015-09-10

  The preset invention provides a curable resin composition which causes little change in heat resistance after a heat history of cured products and exhibits low thermal expandability, and also provides a cured product of the curable resin composition, a printed circuit board causing little change in heat resistance after a heat history and having excellent low thermal expandability, and an epoxy resin having these performances. The epoxy resin is produced by polyglycidyl-etherification of a reaction product of para-cresol, a β-naphthol compound, and formaldehyde, the epoxy resin containing a trifunctional compound (x) represented by a structural formula (1) below and a dimer (y) represented by a structural formula (2) below, and the content of the trifunctional compound (x) is 55% or more in terms of ratio by area in GPC measurement.

  该预设发明提供了一种可固化树脂组合物，其在固化产品的热历史后热阻变化较小，且具有低热膨胀性，同时还提供了该可固化树脂组合物的固化产品、热历史后热阻变化较小且具有优异低热膨胀性的印刷电路板以及具有这些性能的环氧树脂。该环氧树脂是通过对对甲酚、β-萘酚化合物和甲醛的反应产物进行聚环氧丙烷化而生产的，该环氧树脂含有下式（1）所表示的三官能化合物（x）和下式（2）所表示的二聚体（y），其中三官能化合物（x）的含量在GPC测量中按面积比为55％或更高。
• Polyamide composition
  申请人：UBE INDUSTRIES, LTD.

  公开号：EP0101207A1

  公开（公告）日：1984-02-22

  57 A polyamide composition having an enhanced adhesion to coatings, which comprises a polyamide with a ratio of the terminal amino group concentration to the terminal carboxyl group concentration of at least 1.5, an inorganic filler, and a triazine, wherein the amount of the inorganic filler is from 1 to 150 weight parts per 100 weight parts of the polyamide and the amount of the triazine is more than 1 weight part per 100 weight parts of the sum of the polyamide and the inorganic filler.

  57 具有增强涂层附着力的聚酰胺组合物，它包括末端氨基浓度与末端羧基浓度之比至少为 1.5 的聚酰胺、无机填料和三嗪，其中无机填料的用量为每 100 重量份聚酰胺中含 1 至 150 重量份，三嗪的用量为每 100 重量份聚酰胺和无机填料之和中含 1 重量份以上。