4-(but-3-en-1-yloxy)phenyl 4-(but-3-en-1-yloxy)benzoate

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 缩酚酸和缩酚酸环醚类
• 英文名称: 4-(but-3-en-1-yloxy)phenyl 4-(but-3-en-1-yloxy)benzoate
• 英文别名: (4-but-3-enoxyphenyl) 4-but-3-enoxybenzoate
• 化学式: C₂₁H₂₂O₄
• mdl: MFCD00807410
• 分子量: 338.403
• InChiKey: GATJFAOWTVFOGS-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  25
• 可旋转键数：
  11
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.19
• 拓扑面积：
  44.8
• 氢给体数：
  0
• 氢受体数：
  4

反应信息

• 作为反应物：
  描述：

  4-(but-3-en-1-yloxy)phenyl 4-(but-3-en-1-yloxy)benzoate 在 双氧水 作用下， 以 水 、 甲苯 为溶剂， 反应 6.0h， 以89%的产率得到4-[2-(2-环氧乙基)乙氧基]苯甲酸4-[2-(2-环氧乙基)乙氧基]苯酯
  参考文献：
  名称：

  JP5862479

  摘要：

  公开号：

文献信息

• COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
  申请人：JNC Corporation

  公开号：EP3425019A1

  公开（公告）日：2019-01-09

  The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.

  本发明包括：一种能够形成热导率高且热膨胀系数可控的散热部件的组合物；以及一种散热部件。这种用于散热部件的组合物包括与第一偶联剂的一端粘接的导热第一无机填料，以及与第二偶联剂的一端粘接的导热第二无机填料，该组合物的特征在于：第一偶联剂和第二偶联剂中至少有一种是液晶硅烷偶联剂；第一偶联剂的另一端和第二偶联剂的另一端各有一个可相互结合的官能团；第一偶联剂的另一端通过固化处理与第二偶联剂的另一端结合。
• COMPOSITION FOR LOW THERMAL EXPANSION MEMBERS, LOW THERMAL EXPANSION MEMBER, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LOW THERMAL EXPANSION MEMBER
  申请人：JNC Corporation

  公开号：EP3425004A1

  公开（公告）日：2019-01-09

  The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler 1 that is bonded to one end of a first coupling agent 11; and a heat conductive second inorganic filler 2 that is bonded to one end of a second coupling agent 12. This composition for low thermal expansion members is also characterized in that the first inorganic filler 1 and the second inorganic filler 2 are bonded to each other via the first coupling agent 11 and the second coupling agent 12 by means of a curing treatment.

  本发明提供：一种用于低热膨胀构件的组合物，该组合物能够形成低热膨胀构件，该构件的热膨胀系数接近半导体元件内构件的热膨胀系数，同时具有高耐热性和高导热性；以及一种低热膨胀构件。根据本发明的低热膨胀构件组合物，其特征在于含有：与第一耦合剂 11 的一端粘合的导热第一无机填料 1；以及与第二耦合剂 12 的一端粘合的导热第二无机填料 2。这种用于低热膨胀构件的组合物的另一个特点是，第一无机填料 1 和第二无机填料 2 通过第一偶联剂 11 和第二偶联剂 12 经固化处理相互粘结在一起。
• Composition for heat-dissipating member, heat-dissipating member, electronic instrument, method for producing composition for heat-dissipating member, and method for producing heat-dissipating member
  申请人：JNC CORPORATION

  公开号：US10679922B2

  公开（公告）日：2020-06-09

  The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.

  本发明包括：一种能够形成热导率高且热膨胀系数可控的散热部件的组合物；以及一种散热部件。这种用于散热部件的组合物包括与第一偶联剂的一端粘接的导热第一无机填料，以及与第二偶联剂的一端粘接的导热第二无机填料，该组合物的特征在于：第一偶联剂和第二偶联剂中至少有一种是液晶硅烷偶联剂；第一偶联剂的另一端和第二偶联剂的另一端各有一个可相互结合的官能团；第一偶联剂的另一端通过固化处理与第二偶联剂的另一端结合。
• LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE
  申请人：JNC CORPORATION

  公开号：US20210187902A1

  公开（公告）日：2021-06-24

  The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
• US7527746B2
  申请人：——

  公开号：US7527746B2

  公开（公告）日：2009-05-05