2-Phenyl-4.6-diaethylamino-s-triazin | 1972-98-1

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: 2-Phenyl-4.6-diaethylamino-s-triazin
• 英文别名: N,N'-diethyl-6-phenyl-[1,3,5]triazine-2,4-diamine；N~2~,N~4~-Diethyl-6-phenyl-1,3,5-triazine-2,4-diamine；2-N,4-N-diethyl-6-phenyl-1,3,5-triazine-2,4-diamine
• CAS: 1972-98-1
• 化学式: C₁₃H₁₇N₅
• 分子量: 243.311
• InChiKey: JORVMOGILHGALE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3.4
• 重原子数：
  18
• 可旋转键数：
  5
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.31
• 拓扑面积：
  62.7
• 氢给体数：
  2
• 氢受体数：
  5

文献信息

• EPOXY/ACID ANHYDRIDE COMPOSITION
  申请人：NISSAN CHEMICAL INDUSTRIES, LIMITED

  公开号：EP0834523A1

  公开（公告）日：1998-04-08

  (Object) It is to provide an epoxy/acid anhydride composition comprising an epoxy compound and an acid anhydride serving as a curing agent wherein a substituted triazine of a specific structure is employed as a curing accelerator to thereby impart a long pot life, a high storage stability and good working characteristics to the composition and cause no defect such as bubbling or cracking in the cured resin. (Constitution of the invention) An epoxy/acid anhydride composition characterized by containing, as a curing accelerator, a substituted triazine of the formula [] (wherein X is an amino group, C1-18 monoalkylamino group, di C1-18 alkylamino group, morpholino group, piperidino group, methyl group or phenyl group; R1 and R2 independently each represent C1-12 alkyl group, C1-12 hydroxyalkyl group, C4-8 cycloalkyl group, C5-9 cycloalkylmethyl group or C5-9 methylcycloalkyl group) in an epoxy/acid anhydride composition in which an epoxy compound and an acid anhydride-curing agent are contained, and an epoxy/acid anhydride resin composition prepared by thermosetting the epoxy/acid anhydride composition.

  目的 提供一种环氧/酸酐组合物，该组合物由环氧化合物和用作固化剂的酸酐组成，其中使用了特定结构的取代三嗪作为固化促进剂，从而使该组合物具有较长的固化寿命、较高的储存稳定性和良好的工作特性，并且不会导致固化树脂出现气泡或开裂等缺陷。 (本发明的结构） 一种环氧树脂/酸酐组合物，其特征在于含有式[]的取代三嗪作为固化促进剂。 (其中 X 是氨基、C1-18 单烷基氨基、二 C1-18 烷基氨基、吗啉基、哌啶基、甲基或苯基；R1 和 R2 各自独立地代表环氧化合物和酸酐固化剂的环氧/酸酐组合物中的 C1-12 烷基、C1-12 羟基烷基、C4-8 环烷基、C5-9 环烷基甲基或 C5-9 甲基环烷基），以及通过热固化该环氧/酸酐组合物制备的环氧/酸酐树脂组合物。
• Sealant Epoxy-Resin Molding Material, and Electronic Component Device
  申请人：Akagi Seiichi

  公开号：US20080234409A1

  公开（公告）日：2008-09-25

  Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R 1 s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; n represents an integer of 0-4; R 2 s may be the same or different and respectively represent one selected from substituted or unsubstituted hydrocarbon groups having 1-12 carbon atoms and substituted or unsubstituted alkoxy groups having 1-12 carbon atoms; and m represents an integer of 0-6.)
• Epoxy Resin Composition for Sealing and Electronic Component Device
  申请人：Ikezawa Ryoichi

  公开号：US20090062430A1

  公开（公告）日：2009-03-05

  The invention relates to an epoxy resin composition for sealing comprising (A) an epoxy resin, and (B) a curing agent, wherein the following is comprised as the curing agent (B): (C) a compound or compounds represented by the following general formula (I) in which n is or n's are each an integer of 1 to 10, and m is or m's are each an integer of 1 to 10: wherein R 1 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms, and R 2 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms. This makes it possible to provide a halogen-free and antimony-free epoxy resin composition for sealing which is good in flame retardancy without lowering reliabilities, such as moldability, reflow resistance, humidity resistance and high-temperature-standing property, and an electron component device equipped with an element sealed with this composition.
• US4140658A
  申请人：——

  公开号：US4140658A

  公开（公告）日：1979-02-20
• US6124381A
  申请人：——

  公开号：US6124381A

  公开（公告）日：2000-09-26