BONDING METHOD, BONDABILITY IMPROVING AGENT, SURFACE MODIFICATION METHOD, SURFACE MODIFYING AGENT, AND NOVEL COMPOUND
申请人:Mori, Kunio
公开号:EP2623572A1
公开(公告)日:2013-08-07
[Problem] To provide a technique by which an -OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (α) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (α) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (α) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.
[问题]提供一种技术,通过该技术可以在材料表面有效地形成-OH 基团,从而使材料适于利用化学反应(化学结合)进行结合(例如,分子结合)。[解决方案]一种用于粘合基底 A 和基底 B 的粘合方法,包括:在基底 A 表面涂抹含有下述化合物 (α)的药剂的步骤;将基底 B 排列成正对基底 A 表面的化合物 (α)的步骤;以及通过在基底 A 和/或基底 B 上施加作用力来整体粘合基底 A 和基底 B 的步骤。化合物 (α)是一种在每个分子中都有一个 OH 基团或一个 OH 形成基团、一个叠氮基团和一个三嗪环的化合物,基底 A 是用聚合物配置的。