2,2'-[(3-Hydroxyphenyl)methylene]bis(3,5,6-trimethylphenol) | 195301-80-5

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 2,2'-[(3-Hydroxyphenyl)methylene]bis(3,5,6-trimethylphenol)
• 英文别名: 2-[(3-hydroxyphenyl)-(2-hydroxy-3,4,6-trimethylphenyl)methyl]-3,5,6-trimethylphenol
• CAS: 195301-80-5
• 化学式: C₂₅H₂₈O₃
• 分子量: 376.5
• InChiKey: NFAYTNZXRQMYGT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.4
• 重原子数：
  28
• 可旋转键数：
  3
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.28
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

文献信息

• PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR IMPROVING DRY ETCHING RESISTANCE OF PHOTOSENSITIVE RESIN COMPOSITION
  申请人：CLARIANT INTERNATIONAL LTD.

  公开号：EP1146394A1

  公开（公告）日：2001-10-17

  A radiation sensitive resin composition which is capable of forming excellent patterns and is highly sensitive and excellent in dry-etching resistance, as well as a process on the improvement of dry-etching resistance. The radiation sensitive resin composition comprises an alkali-soluble resin, a radiation sensitive material and a compound with phenolic hydroxyl groups which has a value of 30 or more in parameter (P) shown in formula 1 below.[Formula 1] parameter (P) = [(13.0 x number of hydroxyl groups in an additive)/(number of benzene rings in an additive)] + [(14.0 x number of diazo- coupling reaction points in an additive) / (number of benzene rings in an additive)] wherein the number of diazo-coupling reaction points is the number of unsubstituted carbon atoms at o- and p-positions relative to the positions of hydroxyl groups in the benzene ring in the compound.

  一种能形成优异图案、灵敏度高且耐干蚀性优异的辐射敏感树脂组合物，以及一种改善耐干蚀性的工艺。辐射敏感树脂组合物由碱溶性树脂、辐射敏感材料和酚羟基化合物组成，酚羟基化合物的参数（P）值大于或等于 30，如下式 1 所示。 [式 1] 参数（P）=[（13.0 x 添加剂中的羟基数）/（添加剂中的苯环数）] + [（14.0 x 添加剂中的二羟基数）/（添加剂中的苯环数）]。+ [(14.0 x 添加剂中重氮偶联反应点数)/(添加剂中苯环数)]，其中重氮偶联反应点数是相对于化合物中苯环羟基位置的 o 位和 p 位未取代碳原子的数目。
• PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1630605A1

  公开（公告）日：2006-03-01

  This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.

  本发明涉及一种可在碱性显影剂中显影的底片工作感光树脂组合物。 这种感光树脂组合物包括：(a) 聚酰亚胺，其聚合物主链末端具有至少一个选自羧基、酚羟基、磺酸基和硫醇基的基团；(b) 具有由不饱和双键和/或三键组成的可聚合官能团的化合物；以及 (c) 光聚合引发剂。
• ADHESIVE FILM AND SEMICONDUCTOR DEVICE USING SAME
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP1918341A1

  公开（公告）日：2008-05-07

  The present invention relates to an adhesive film comprising a polyimide resin (A) and a thermosetting resin (B), wherein the polyimide resin (A) comprises a polyimide resin having a repeating unit represented by a formula (I) shown below, and the storage elastic modulus of the adhesive film at 250°C, following heat treatment at a temperature of 150 to 230°C for a period of 0.3 to 5 hours, is not less than 0.2 MPa: (wherein, the m R1 groups each represent, independently, a bivalent organic group, the m R1 groups include a total of k organic groups selected from the group consisting of -CH2-, -CHR- and -CR2- (wherein, R represents a non-cyclic alkyl group of 1 to 5 carbon atoms), m represents an integer of not less than 8, m and k satisfy a relationship: k/m ≥ 0.85, and R2 represents a tetracarboxylic acid residue).

  本发明涉及一种由聚酰亚胺树脂（A）和热固性树脂（B）组成的胶膜，其中聚酰亚胺树脂（A）由具有下图所示式（I）代表的重复单元的聚酰亚胺树脂组成，在 150 至 230°C 的温度下进行 0.3 至 5 小时的热处理后，胶膜在 250°C 下的存储弹性模量不小于 0.2 兆帕： (其中，m个R1基团各自独立地代表一个二价有机基团，m个R1基团包括总共k个有机基团，这些有机基团选自由-CH2-、-CHR-和-CR2-组成的组(其中，R代表1至5个碳原子的非环烷基)，m代表不小于8的整数，m和k满足一种关系：k/m≥0.85，R2代表四羧酸残基)。
• Resin, photosensitive resin composition, electronic component and display device using the same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11333976B2

  公开（公告）日：2022-05-17

  A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):

  本发明提供了一种线性热膨胀系数小、吸水性低的树脂。该树脂的特点是至少包括一种结构，这些结构选自以下通式（1）和（2）所代表的结构：
• Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same
  申请人：——

  公开号：US20030062630A1

  公开（公告）日：2003-04-03

  An adhesive film for semiconductor, which has a three-layer structure consisting of a support film having each face coated with an adhesive layer, each adhesive layer containing (A) a heat resistant thermoplastic resin having a glass transition temperature of 130 to 300° C., a water absorption of 3% by weight or less and a squeeze length of 2 mm or less, (B) an epoxy resin and (C) a trisphenol compound as an epoxy resin-curing agent; a lead frame with adhesive film; and a semiconductor device wherein the lead frame with adhesive film is bonded to a semiconductor element.

  一种半导体用粘合膜，其三层结构包括：支撑膜，支撑膜的每个面都涂有粘合剂层，每个粘合剂层都含有(A)耐热热塑性树脂，该树脂的玻璃化温度为 130 至 300°C，吸水率不超过 3%（重量百分比），挤压长度不超过 2 毫米，(B)环氧树脂和(C)作为环氧树脂固化剂的三苯酚化合物；带粘合膜的引线框架；以及半导体设备，其中带粘合膜的引线框架与半导体元件粘合在一起。