4,4'-[(2-Hydroxy-3-methoxyphenyl)methylene]bis(2,5-dimethylphenol) | 154256-09-4

• 分子结构分类: 有机化合物 - 苯类化合物 - 三苯基化合物
• 英文名称: 4,4'-[(2-Hydroxy-3-methoxyphenyl)methylene]bis(2,5-dimethylphenol)
• 英文别名: 4-[(4-hydroxy-2,5-dimethylphenyl)-(2-hydroxy-3-methoxyphenyl)methyl]-2,5-dimethylphenol
• CAS: 154256-09-4
• 化学式: C₂₄H₂₆O₄
• 分子量: 378.5
• InChiKey: QHXRLMHIDWGUIZ-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.7
• 重原子数：
  28
• 可旋转键数：
  4
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  69.9
• 氢给体数：
  3
• 氢受体数：
  4

文献信息

• PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1630605A1

  公开（公告）日：2006-03-01

  This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.

  本发明涉及一种可在碱性显影剂中显影的底片工作感光树脂组合物。 这种感光树脂组合物包括：(a) 聚酰亚胺，其聚合物主链末端具有至少一个选自羧基、酚羟基、磺酸基和硫醇基的基团；(b) 具有由不饱和双键和/或三键组成的可聚合官能团的化合物；以及 (c) 光聚合引发剂。
• Resin, photosensitive resin composition, electronic component and display device using the same
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11333976B2

  公开（公告）日：2022-05-17

  A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2):

  本发明提供了一种线性热膨胀系数小、吸水性低的树脂。该树脂的特点是至少包括一种结构，这些结构选自以下通式（1）和（2）所代表的结构：
• Photosensitive resin precursor composition
  申请人：Fujita Yoji

  公开号：US20050014876A1

  公开（公告）日：2005-01-20

  The present invention relates to a positive photosensitive resin precursor composition which exhibits good storage stability after exposure. A photosensitive resin precursor composition comprises (a) a polymer essentially composed of a structural unit expressed by formula (1); (b) at least two photo acid generators; and (c) a compound having an alkoxymethyl group: wherein R 1 represents an organic group with a valence of 2 to 8, having at least two carbon atoms; R 2 represents an organic group with a valence of 2 to 6, having at least two carbon atoms; R 3 represents hydrogen or an organic group having a carbon number in the range of 1 to 20; n represents a number ranging from 10 to 100,000; m represents an integer in the range of 0 to 2; and p and q represent integers in the range of 0 to 4 and satisfy p+q>0.

  本发明涉及一种阳性光敏树脂前体组合物，该组合物在曝光后具有良好的贮存稳定性。 光敏树脂前体组合物包括：(a) 主要由式（1）表示的结构单元组成的聚合物；(b) 至少两个光酸发生器；和(c) 具有烷氧基甲基的化合物： 其中 R 1 代表价数为 2 至 8 的有机基团，至少有两个碳原子； R 2 代表价数为 2-6 的有机基团，至少有两个碳原子； R 2 3 代表氢或碳原子数在 1 至 20 之间的有机基团；n 代表 10 至 100,000 之间的数字；m 代表 0 至 2 之间的整数；p 和 q 代表 0 至 4 之间的整数，且满足 p+q>0 的条件。
• Photosensitive resin composition, electronic component using the same, and display using same
  申请人：Suwa Mitsuhito

  公开号：US20060159839A1

  公开（公告）日：2006-07-20

  This invention relates to a negative-working photosensitive resin composition that can be developed in an alkaline developer. This photosensitive resin composition comprises: (a) a polyimide having at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group, and a thiol group at the terminus of the polymer main chain; (b) a compound having a polymerizable functional group comprising unsaturated double and/or triple bonds; and (c) a photopolymerization initiator.

  本发明涉及一种可在碱性显影剂中显影的底片工作感光树脂组合物。这种感光树脂组合物包括：(a) 聚酰亚胺，其聚合物主链末端具有至少一个选自羧基、酚羟基、磺酸基和硫醇基的基团；(b) 具有由不饱和双键和/或三键组成的可聚合官能团的化合物；以及 (c) 光聚合引发剂。
• PHOTOSENSITIVE RESIN COMPOSITION
  申请人：TORAY INDUSTRIES, INC.

  公开号：EP1630605B1

  公开（公告）日：2017-10-11