SILICON-CONTAINING CURABLE COMPOSITION, CURED PRODUCT OF THE SILICON-CONTAINING CURABLE COMPOSITION AND LEAD FRAME SUBSTRATE FORMED OF THE SILICON-CONTAINING CURABLE COMPOSITION
申请人:Adeka Corporation
公开号:EP2581417A1
公开(公告)日:2013-04-17
The silicon-containing curable composition of the present invention includes: 100 parts by mass of a silicon-containing polymer having a Mw of 3,000 to 100,000 obtainable by hydrolysis-condensation of a organosilane mixture including 5 to 50 mol% of R1SiX3, 0 to 50 mol% of R2SiX3, 0 to 40 mol% of R3R4SiX2 and 0 to 50 mol% of R5SiX3, wherein the total of R2SiX3 and R3R4SiX2 is 5 to 60 mol%, 0 to 200 parts by mass of a prepolymer having two or more Si-H groups in one molecule obtainable by a hydrosilylation reaction of a copolymer of the formula (2) and a compound of the formula (3) or (3'), 0 to 30 parts by mass of a cyclic siloxane compound having two or more C-C double bonds having reactivity with Si-H groups in one molecule, 0.0001 to 10 parts by mass of an organic peroxide and 0 to 1.0 parts by mass of a metal catalyst, and 10 to 1,500 parts by mass of a filler, wherein R1 is a C2-6 alkenyl group, R2 is a C1-6 alkyl group, R3 and R4 are each a C1-6 alkyl group or the like, R5 is a phenyl group optionally substituted with a C1-6 alkyl group, and X is a C1-6 alkoxy group or the like, one or more of R2 to R4 is a methyl group, R6 to R8 each represents a C1-6 alkyl group or a phenyl group, or the like, f represents a number of 2 to 10, g represents a number of 0 to 8, and n represents 1 or 2.
本发明的含硅可固化组合物包括100份(质量)Mw为3,000至100,000的含硅聚合物,可通过水解-缩合有机硅烷混合物获得,该混合物包括5至50摩尔%的R1SiX3、0至50摩尔%的R2SiX3、0至40摩尔%的R3R4SiX2和0至50摩尔%的R5SiX3,其中R2SiX3和R3R4SiX2的总含量为5至60摩尔%、0 至 200 份(质量份)通过式(2)共聚物和式(3)或(3')化合物的氢硅烷化反应可获得的单分子中含有两个或多个 Si-H 基团的预聚物, 0 至 30 份(质量份)单分子中含有两个或多个与 Si-H 基团具有反应活性的 C-C 双键的环状硅氧烷化合物, 0.0001 至 10 质量份的有机过氧化物和 0 至 1.其中 R1 是 C2-6 烯基,R2 是 C1-6 烷基,R3 和 R4 分别是 C1-6 烷基或类似基团,R5 是任选被 C1-6 烷基取代的苯基、X 是 C1-6 烷氧基或类似物,R2 至 R4 中的一个或多个是甲基,R6 至 R8 各代表 C1-6 烷基或苯基或类似物,f 代表 2 至 10 的数字,g 代表 0 至 8 的数字,n 代表 1 或 2。