2-(Ethenoxymethoxy)-4-(oxiran-2-yl)-6-(oxiran-2-ylmethoxy)-1,3,5-triazine

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: 2-(Ethenoxymethoxy)-4-(oxiran-2-yl)-6-(oxiran-2-ylmethoxy)-1,3,5-triazine
• 英文别名: 2-(ethenoxymethoxy)-4-(oxiran-2-yl)-6-(oxiran-2-ylmethoxy)-1,3,5-triazine
• 化学式: C₁₁H₁₃N₃O₅
• 分子量: 267.24
• InChiKey: SBCDIIGDIBVGQE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  19
• 可旋转键数：
  8
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.55
• 拓扑面积：
  91.4
• 氢给体数：
  0
• 氢受体数：
  8

文献信息

• ADHESIVE COMPOSITIONS FOR USE IN DIE ATTACH APPLICATIONS
  申请人：Henkel US IP LLC

  公开号：US20140220337A1

  公开（公告）日：2014-08-07

  Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.