A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.
一种正性光刻胶组合物,包括 (A) 100 份(重量)碱溶性
酚醛
树脂,并以其为基础;(B) 5 至 50 份(按重量计)碱溶性
丙烯酸树脂,其中含有 10 至 80% (按重量计)具有醇羟基的可自由基聚合的化合物单元,以及 3 至 50% (按重量计)具有羧基的可自由基聚合的化合物单元和具有
酚羟基的可自由基聚合的化合物单元中的至少一种; (C) 5 至 100 份(按重量计)含醌
噻嗪基的化合物;以及 (D) 溶剂。这种组合物在显影时对基底具有良好的附着力和良好的耐电镀溶液性,而且可以很好地润湿电镀溶液,可以很好地用碱性显影液显影,可以很好地从基底的抗蚀剂未暴露区域剥离,适合形成适合作为凸点形成材料的厚膜。