申请人:Rhone-Poulenc S.A.
公开号:US03933729A1
公开(公告)日:1976-01-20
The properties of organosilicon compositions based on .alpha.-.omega.-dihydroxy diorganopolysiloxanes, methyl polysiloxanes, fillers, amino organosilicon corss linking agents and optionally alkyl silicates or polysilicates, which are vulcanisable at ambient temperature or above, are improved by using a methylpolysiloxane in which the ratio of the R(CH.sub.3).sub.2 SiO.sub.0.5 units (R=C.sub.1 --C.sub.3 alkyl or vinyl) to SiO.sub.2 units is 0.4:1 to 1.2:1 and which contains 0.5 - 3.5% by weight OH groups bonded to Si and by using an amino organosilicon compound which is an aminoorganosilane of the general formula (i) (R"O).sub.3.sub.- p R'.sub.p Si[(CH.sub.2).sub.n O].sub.m (CH.sub.2).sub.t NHQ in which R' represents an alkyl group with 1 to 4 carbon atoms, a vinyl group or a phenyl group, R" represents a methyl, ethyl or methoxyethyl radical, Q represents a hydrogen atom or the radical --(CH.sub.2).sub.2 NH.sub.2, p and m represent 0 or 1, n represents 1, 2, 3 or 4, and t represents 2 or 3, or an aminoorganopolysiloxane produced by reacting the aminoorganosilane (i) above, in which p is 0, with a hydroxylic methylpolysiloxane polymer (ii) containing at least 2% by weight of hydroxyl groups bonded to the silicon atoms, of viscosity 1 cPo at 25.degree.C to 1,000 cPo at 25.degree.C, of the average general formula (CH.sub.3).sub.a (HO).sub.b SiO.sub.(4.sup.-a.sup.-b)/2 in which a represents any number from 1.6 to 2.3 and b represents any number ranging from 0.1 to 1; the amounts of aminoorganosilane (i) and hydroxylic methylpolysiloxane polymer (ii) being such that there are 0.4 to 1.2 mols of (i) per gram-(hydroxyl group) (that is to say 17 g) of (ii). The new compositions have improved fluidity characteristics and pot life, and adhere easily to most surfaces without using a primer and can be used particularly to protect electronic connections.
基于α-ω-二羟基二有机聚硅氧烷、甲基聚硅氧烷、填料、氨基有机硅交联剂和可选的烷基硅酸盐或聚硅酸盐的有机硅组合物的性能可以通过使用甲基聚硅氧烷来改善,其中R(CH3)2SiO0.5单位(R = C1-C3烷基或乙烯基)与SiO2单位的比率为0.4:1至1.2:1,并且其中含有0.5-3.5%的重量OH基团与Si键合,并且通过使用氨基有机硅化合物来改善,该氨基有机硅化合物是一般式(i)的氨基有机硅烷(R“O)3-pR'pSi[(CH2)nO]m(CH2)tNHQ,其中R'表示具有1至4个碳原子的烷基、乙烯基或苯基,R"表示甲基、乙基或甲氧基乙基基团,Q表示氢原子或基团-(CH2)2NH2,p和m表示0或1,n表示1、2、3或4,t表示2或3,或由反应上述式(i)中p为0的氨基有机硅烷和至少含有2%重量羟基键合到硅原子的粘度为1 cPo至1,000 cPo的羟基甲基聚硅氧烷聚合物(ii)制备的氨基有机聚硅氧烷,其平均一般式为(CH3)a(HO)bSiO(4-a-b)/2,其中a表示从1.6到2.3的任意数字,b表示从0.1到1的任意数字;氨基有机硅烷(i)和羟基甲基聚硅氧烷聚合物(ii)的量使得每克(羟基基团)(即17克)的(ii)中有0.4至1.2摩尔的(i)。新的组合物具有改善的流动性和搁置寿命,并且可以轻松地附着于大多数表面而不使用底漆,特别用于保护电子连接。