Copper;titanium | 12019-62-4

• 分子结构分类: 无机化合物 - 均相金属化合物 - 均相过渡金属化合物
• 英文名称: Copper;titanium
• 英文别名: copper;titanium
• CAS: 12019-62-4
• 化学式: Cu₃Ti₂
• 分子量: 286.398
• InChiKey: DRGZCVNOPLELSW-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.01
• 重原子数：
  5
• 可旋转键数：
  0
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  0
• 氢给体数：
  0
• 氢受体数：
  0

反应信息

• 作为产物：
  描述：

  以 neat (no solvent) 为溶剂， 生成 Copper;titanium
  参考文献：
  名称：

  Crystallization kinetics of Cu3Ti2 forming from Cu60Ti40 glass

  摘要：

  Amorphous to crystalline transformation in Cu60Ti40 alloy has been studied under conditions of constant heating rate experiments, using XRD and DSC. In the high temperature XRD experiment, the transformation has been monitored continuously as the integrated X-ray intensity corresponding to a chosen reflection from one of the two crystalline products forming at close by temperatures. Differentiation of the curve thus obtained gives the transformation rate curve which passes through a maximum, From the peak shift with heating rate, the activation energy for the formation of Cu3Ti2 crystalline phase has been obtained. The results have been compared with those obtained by DSC.

  DOI：

  10.1007/bf02636125

文献信息

• Enthalpies of formation of Ti-Cu intermetallic and amorphous phases
  作者：C. Colinet、A. Pasturel、K.H.J. Buschow

  DOI：10.1016/s0925-8388(96)02590-x

  日期：1997.1

  Abstract The enthalpies of formation of the various intermetallic and amorphous phases of the TiCu binary system were measured by solution calorimetry in molten aluminum. The experimental results were compared with the values predicted by Miedema's model.

  摘要 用溶液量热法测定了钛Cu 二元体系中各种金属间相和非晶相的形成焓。将实验结果与 Miedema 模型预测的值进行比较。
• Svatovskaya, L. B.; Sychev, M. M.; Ryabinina, G. A., Journal of applied chemistry of the USSR, 1981, vol. 54, p. 576 - 580
  作者：Svatovskaya, L. B.、Sychev, M. M.、Ryabinina, G. A.、Korneeva, T. A.

  DOI：——

  日期：——
• ——
  作者：A. Adlaßnig、J. C. Schuster、R. Reicher、W. Smetana

  DOI：10.1023/a:1004449328549

  日期：——

  Currently only glass bonding thick film conductor systems are commercially available for metallizing AIN-ceramic. The glass phase formed between metallization and ceramic impairs the high thermal conductivity of AIN. A new glass frit free metallization system has been developed utilizing the bonding mechanism of active brazing to provide the adhesion of metallization onto the ceramic. Aspects of paste preparation range from the derivation of the metallic powder to the selection of an appropriate printing vehicle which must decompose completely during the firing process under an inert atmosphere. The adhesion strength of the new paste system with the alternative bonding mechanism has been evaluated and contrasted with that of standard thick film pastes. (C) 1998 Kluwer Academic Publishers.