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1,3-Dibenzyl-5-allylisocyanurat | 67364-48-1

中文名称
——
中文别名
——
英文名称
1,3-Dibenzyl-5-allylisocyanurat
英文别名
1-allyl-3,5-dibenzyl-[1,3,5]triazinane-2,4,6-trione;1,3-Dibenzyl-5-prop-2-enyl-1,3,5-triazinane-2,4,6-trione
1,3-Dibenzyl-5-allylisocyanurat化学式
CAS
67364-48-1
化学式
C20H19N3O3
mdl
——
分子量
349.389
InChiKey
GZUCGSVBLQZUOA-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 熔点:
    185.5-186.5 °C
  • 沸点:
    527.0±49.0 °C(Predicted)
  • 密度:
    1.270±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    3
  • 重原子数:
    26
  • 可旋转键数:
    6
  • 环数:
    3.0
  • sp3杂化的碳原子比例:
    0.15
  • 拓扑面积:
    60.9
  • 氢给体数:
    0
  • 氢受体数:
    3

反应信息

  • 作为产物:
    描述:
    sodium;1,5-dibenzyl-4,6-dioxo-1,3,5-triazin-2-olate 、 3-溴丙烯 以57%的产率得到
    参考文献:
    名称:
    ERITSYAN M. L.; MARUKYAN A. O.; AGASARYAN A. V., AJKAKAN KIMIAKAN AMSAGIR, ARM. XIM. ZH., 1978, 31, HO 5, 366-367
    摘要:
    DOI:
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文献信息

  • CURABLE COMPOSITION AND MULTILAYERED CIRCUIT SUBSTRATE
    申请人:Zeon Corporation
    公开号:EP1275695A1
    公开(公告)日:2003-01-15
    This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.
    本发明提供了一种在阻燃性、绝缘性和粘合性方面都非常出色,并且在燃烧时不会产生有害物质的多层电路板,以及一种适用于获得多层电路板的固化组合物。该固化组合物含有绝缘树脂(如脂环烯烃聚合物或芳香族聚醚聚合物)、氮型固化剂(如 1,3-二烯丙基-5-缩水甘油氰尿酸酯)和型阻燃剂(如磷酸酯酰胺),并通过溶液浇铸法成型为薄膜。将形成的薄膜层压在内层板上,然后固化,得到多层电路基板。
  • OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS
    申请人:Zeon Corporation
    公开号:EP1408064A1
    公开(公告)日:2004-04-14
    A ring-opened metathesis copolymer and its hydrogenated product having a desired monomer unit ratio and a high molecular weight and having hydroxyl groups or hydroxycarbonyl groups can be obtained by conducting a ring-opening metathesis copolymerization of a norbornene-type monomer having hydroxyl groups or hydroxycarbonyl groups with an unsubstituted norbornene-type monomer having at least three rings in the presence of a catalyst predominantly comprised of an organic ruthenium compound having coordinated therewith a neutral electron-donating ligand, and, if desired, hydrogenating the resulting copolymer. The thus-obtained ring-opened metathesis copolymer and its hydrogenation product are characterized by having a low water absorption, good adhesion to metal and other materials, good compatibility with a curing agent and other compounds, and high heat resistance, and exhibiting reduced signal retardation and signal noise.
    在主要由有机钌化合物组成的催化剂存在下,将具有羟基或羟羰基的降冰片烯类单体与具有至少三个环的未取代降冰片烯类单体进行开环偏析共聚,可获得具有所需单体单元比和高分子量且具有羟基或羟羰基的开环偏析共聚物及其氢化产物、如果需要,对得到的共聚物进行氢化。这样得到的开环偏聚共聚物及其氢化产物的特点是吸性低,与属和其他材料的粘附性好,与固化剂和其他化合物的相容性好,耐热性高,并能减少信号延迟和信号噪声。
  • HARDENABLE COMPOSITION, HARDENING PRODUCT, PROCESS FOR PRODUCING THE SAME AND LIGHT EMITTING DIODE SEALED WITH THE HARDENING PRODUCT
    申请人:KANEKA CORPORATION
    公开号:EP1505121A1
    公开(公告)日:2005-02-09
    The present invention provides a curable composition providing a curing product having excellent adhesive properties and high transparency, or a curing product having high toughness and transparency. A curable composition which contains (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in each molecule, (B) a silicon compound having at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound, and (E) a silanol condensation catalyst. A light-emitting diode sealed with a curing product obtainable by curing said curable composition.
    本发明提供了一种可固化组合物,该组合物提供了一种具有优异粘合性能和高透明度的固化产品,或一种具有高韧性和高透明度的固化产品。 一种可固化组合物,其中包含:(A) 每分子中至少有两个碳碳双键与 SiH 基团反应的有机化合物;(B) 每分子中至少有两个 SiH 基团的化合物;(C) 硅烷化催化剂;(D) 硅烷偶联剂和/或含环氧基团的化合物;以及 (E) 硅烷醇缩合催化剂。一种密封有固化产物的发光二极管,该固化产物可通过固化所述可固化组合物获得。
  • SEALING MATERIAL COMPOSITION
    申请人:KANEKA CORPORATION
    公开号:EP1743928A1
    公开(公告)日:2007-01-17
    The present invention relates to a sealing material composition comprising a novel resin composition and excellent not only in gas barrier properties but also in hot melt adhesive properties, in particular. It also relates to a sealing material made by using the above-mentioned composition, in particular a sealing material for double glazing. The present invention can be accomplished by using a sealing material composition which comprises an alkenyl group-terminated isobutylene-based polymer (A), a thermoplastic resin (B) and a compound (C) containing at least two hydrosilyl groups within the molecule thereof.
    本发明涉及一种密封材料组合物,该组合物包含一种新型树脂组合物,不仅气体阻隔性能优异,而且热熔粘合性能尤其优异。本发明还涉及使用上述组合物制成的密封材料,特别是用于双层玻璃的密封材料。本发明可以通过使用一种密封材料组合物来实现,该组合物由烯基端异丁烯基聚合物 (A)、热塑性树脂(B)和在其分子中至少含有两个基团的化合物(C)组成。
  • Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions
    申请人:ZEON CORPORATION
    公开号:EP1803761A1
    公开(公告)日:2007-07-04
    A ring-opened metathesis copolymer and its hydrogenated product having a desired monomer unit ratio and a high molecular weight and having hydroxyl groups can be obtained by conducting a ring-opening metathesis copolymerization of a norbornene-type monomer having hydroxyl groups with an unsubstituted norbornene-type monomer having at least three rings in the presence of a catalyst predominantly comprised of an organic ruthenium compound having coordinated therewith a neutral electron-donating ligand, and, if desired, hydrogenating the resulting copolymer. The thus-obtained ring-opened metathesis copolymer and its hydrogenation product are characterized by having a low water absorption, good adhesion to metal and other materials, good compatibility with a curing agent and other compounds, and high heat resistance, and exhibiting reduced signal retardation and signal noise.
    在主要由有机钌化合物组成的催化剂存在下,将具有羟基的降冰片烯类单体与具有至少三个环的未取代降冰片烯类单体进行开环偏析共聚,并在需要时对所得共聚物进行氢化,可获得具有所需单体单元比和高分子量且具有羟基的开环偏析共聚物及其氢化产物。这样得到的开环偏聚共聚物及其氢化产物的特点是吸性低,与属和其他材料的粘附性好,与固化剂和其他化合物的相容性好,耐热性高,并能减少信号延迟和信号噪声。
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