A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV:
wherein each of R1, R2, R3, R4, and R5 is independently selected from the group consisting of H, methyl, ethyl, n-propyl, iso-propyl, a butyl, and phenyl. Epoxy-based compositions including various curing agents are also disclosed. Other epoxy curatives containing amino, phenol, and/or imine groups are disclosed.
[EN] CURING AGENTS FOR EPOXY RESINS<br/>[FR] AGENTS DE POLYMÉRISATION POUR RÉSINES ÉPOXY
申请人:DESIGNER MOLECULES INC
公开号:WO2011116050A2
公开(公告)日:2011-09-22
The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.
CURING AGENTS FOR EPOXY RESINS
申请人:Dershem Stephen M
公开号:US20130012620A1
公开(公告)日:2013-01-10
The present invention relates to curatives for epoxy resins, and compositions (e.g. adhesives) containing such resins cured using the same methods of preparation and uses therefor. More specifically, the present invention relates to hybrid curatives for epoxy resins comprising both aromatic amine, phenol and/or phenyl ester moieties. A further aspect of the current invention relates to new imidazole catalysts that possess a combination of excellent cure latency as well as low cure temperature onset.