摩熵化学
数据库官网
小程序
打开微信扫一扫
首页 分子通 化学资讯 化学百科 反应查询 关于我们
请输入关键词

4-[2-(2-环氧乙基)乙氧基]苯甲酸4-[2-(2-环氧乙基)乙氧基]苯酯 | 146063-25-4

中文名称
4-[2-(2-环氧乙基)乙氧基]苯甲酸4-[2-(2-环氧乙基)乙氧基]苯酯
中文别名
——
英文名称
Benzoic acid, 4-[2-(2-oxiranyl)ethoxy]-, 4-[2-(2-oxiranyl)ethoxy]phenyl ester
英文别名
[4-[2-(oxiran-2-yl)ethoxy]phenyl] 4-[2-(oxiran-2-yl)ethoxy]benzoate
4-[2-(2-环氧乙基)乙氧基]苯甲酸4-[2-(2-环氧乙基)乙氧基]苯酯化学式
CAS
146063-25-4
化学式
C21H22O6
mdl
——
分子量
370.402
InChiKey
PEUDQALZZZOUAG-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 密度:
    1.257

计算性质

  • 辛醇/水分配系数(LogP):
    3.4
  • 重原子数:
    27
  • 可旋转键数:
    11
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    0.38
  • 拓扑面积:
    69.8
  • 氢给体数:
    0
  • 氢受体数:
    6

上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

点击查看最新优质反应信息

文献信息

  • Polymerizable optically active compound and composition thereof
    申请人:Shundo Ryushi
    公开号:US20070122565A1
    公开(公告)日:2007-05-31
    The compound provided by the present invention is a polymerizable optically active compound represented by Formula (1): wherein R 1 is hydrogen, chlorine or bromine; R 2 is hydrogen, methyl or ethyl; A 1 is 1,4-phenylene, biphenyl-4,4′-diyl, naphthalene-2,6-diyl or pyridine-2,5-diyl, provided that in the 1,4-phenylene arbitrary hydrogen may be replaced by chlorine, bromine or fluorine, and in the biphenyl-4,4′-diyl arbitrary hydrogen may be replaced by chlorine, bromine or fluorine; and X 1 is a single bond, —CH═CH— or —CH 2 CH 2 —.
    本发明提供的化合物是一种可聚合的光学活性化合物,其表示为公式(1): 其中,R1为氢、;R2为氢、甲基或乙基;A1为1,4-苯撑、联苯-4,4'-二基、-2,6-二基或吡啶-2,5-二基,但在1,4-苯撑中任意氢可以被取代,在联苯-4,4'-二基中任意氢可以被取代;X1为单键,-CH═CH-或-CH2CH2-。
  • COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE
    申请人:JNC Corporation
    公开号:EP3141589A1
    公开(公告)日:2017-03-15
    The invention of the present application refers to a composition capable of forming a heat-dissipation member having high thermal conductivity, and a heat-dissipation member. The composition for the heat-dissipation member of the present application contains a polymerizable liquid crystal compound having, at both terminals, a structure including an oxiranyl group or an oxetanyl group; a curing agent that cures the polymerizable liquid crystal compound; and an inorganic filler formed of nitride. A curing temperature of the composition for the heat-dissipation member is within or higher than the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and within or lower than the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. The heat-dissipation member formed of such a composition can have excellent thermal conductivity owing to a synergistic effect between alignment of the liquid crystal compound and the inorganic filler formed of nitride.
    本申请的发明涉及一种能够形成具有高导热性的散热部件的组合物和一种散热部件。本申请的热耗散构件组合物包含一种可聚合液晶化合物,其两端具有包括环氧乙烷基团或环氧乙烷基团的结构;一种固化剂,用于固化可聚合液晶化合物;以及一种由氮化物形成的无机填料。用于热耗散部件的组合物的固化温度在可聚合液晶化合物呈现液晶相的温度范围内或高于该温度范围,并且在可聚合液晶化合物呈现各向同性相的温度范围内或低于该温度范围。由于液晶化合物的排列与氮化物形成的无机填料之间的协同效应,由这种组合物形成的散热部件可以具有极佳的导热性。
  • LAMINATE, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR LAMINATE
    申请人:JNC Corporation
    公开号:EP3424702A1
    公开(公告)日:2019-01-09
    The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
    本发明是一种层压板:通过它可以将半导体元件或类似元件内部不同材料界面处的热膨胀系数差异保持在很小的范围内;具有高耐热性;以及高导热性。这种层压板具有至少两层热膨胀控制部件,热膨胀控制部件包括与第一耦合剂的一端连接的导热第一无机填料,以及与第二耦合剂的一端连接的导热第二无机填料;第一耦合剂的另一端和第二耦合剂的另一端分别与可聚合化合物连接,或相互连接;热膨胀控制部件的热膨胀系数分别不同。
  • COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
    申请人:JNC Corporation
    公开号:EP3425006A1
    公开(公告)日:2019-01-09
    This invention is a composition capable of forming a heat-dissipating member that has high heat resistance and high thermal conductivity. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: the other end of the first coupling agent 11 and the other end of the second coupling agent 12 are each bonded to a bifunctional or higher silsesquioxane 21 by a curing treatment, as illustrated in Fig. 2, for example; or at least one of the first coupling agent and the second coupling agent includes, in the structure thereof, a silsesquioxane, and the other end of the first coupling agent 13 and the other end of the second coupling agent 12 are bonded together as illustrated in Fig. 3, for example.
    本发明是一种能够形成具有高耐热性和高导热性的散热部件的组合物。这种用于热耗散部件的组合物包括与第一偶联剂的一端粘接的导热第一无机填料,以及与第二偶联剂的一端粘接的导热第二无机填料,该组合物的特征在于:第一偶联剂11的另一端和第二偶联剂12的另一端通过固化处理分别与双官能团或更高官能团的倍半氧烷21粘接,如图2所示;或者第一偶联剂和第二偶联剂中的至少一种通过固化处理与双官能团或更高官能团的倍半氧烷21粘接;或者第一偶联剂和第二偶联剂中的至少一种通过固化处理与双官能团或更高官能团的倍半氧烷21粘接。或第一偶联剂和第二偶联剂中至少有一种在其结构中包括倍半氧烷,第一偶联剂 13 的另一端和第二偶联剂 12 的另一端粘合在一起,如图 3 所示。
  • COMPOSITION FOR HEAT-DISSIPATING MEMBER, HEAT-DISSIPATING MEMBER, ELECTRONIC INSTRUMENT, METHOD FOR PRODUCING COMPOSITION FOR HEAT-DISSIPATING MEMBER, AND METHOD FOR PRODUCING HEAT-DISSIPATING MEMBER
    申请人:JNC Corporation
    公开号:EP3425019A1
    公开(公告)日:2019-01-09
    The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
    本发明包括:一种能够形成热导率高且热膨胀系数可控的散热部件的组合物;以及一种散热部件。这种用于散热部件的组合物包括与第一偶联剂的一端粘接的导热第一无机填料,以及与第二偶联剂的一端粘接的导热第二无机填料,该组合物的特征在于:第一偶联剂和第二偶联剂中至少有一种是液晶硅烷偶联剂;第一偶联剂的另一端和第二偶联剂的另一端各有一个可相互结合的官能团;第一偶联剂的另一端通过固化处理与第二偶联剂的另一端结合。
查看更多

同类化合物

非那米柳 雷尼替丁 降钙素(humanreduced),8-L-缬氨酸-(9CI) 间苯甲酰氧基苯乙酮 间苯二甲酸二苯酯 间甲苯基苯甲酸酯 间双没食子酸 醋氨沙洛 邻苯二甲酸苄酯2-乙己基酯 邻苯二甲酸二苯酯-D4 邻苯二甲酸二苯酯 邻甲苯基苯甲酸酯 邻氨基苯甲酸(4-硝基苯基)酯 邻亚苯基二苯甲酸酯 贝诺酯 袋衣酸 血竭黄烷A 萘-1,5-二磺酸-4-[2-(二甲氨基)乙氧基]-2-甲基-5-(丙烷-2-基)苯基2-氨基苯酸酯(1:1) 茶痂衣酸 苯酚,2-[2-[(4-氯苯基)氨基]-4-噻唑基]-,苯酸酯(ester) 苯甲醯柳酸甲酯 苯甲酸苯酯 苯甲酸五氟苯酯 苯甲酸丁香酚酯 苯甲酸4-[[(4-甲氧基苯基)亚甲基]氨基]苯基酯 苯甲酸4-(乙酰氨基)-2-[[2-[4-(乙酰氨基)苯甲酰基]亚肼基]甲基]苯基酯 苯甲酸2-(2-苯并恶唑基)苯酯 苯甲酸-4-甲基苯酯 苯甲酸-(4-环戊基-苯基酯) 苯甲酸-(2-烯丙基-4-溴-苯基酯) 苯甲酸-(2-溴-4,6-二硝基-苯基酯) 苯甲酸-(2,4-二溴-3-甲基-苯基酯) 苯甲酸-(2,4-二氯-5-甲基-苯基酯) 苯甲酸-(2,4-二叔丁基苯基酯) 苯甲酸,4-羟基-,4-[(4-羟基苯氧基)羰基]苯基酯 苯甲酸,4-羟基-,4-(己氧基)苯基酯 苯甲酸,4-羟基-,4-(十四烷氧基)苯基酯 苯甲酸,4-羟基-,4-(十二烷氧基)苯基酯 苯甲酸,4-甲酰基-,4-(辛氧基)苯基酯 苯甲酸,4-甲氧基-,2-甲酰基苯基酯 苯甲酸,4-甲基-,4-甲基苯基酯 苯甲酸,4-戊基-,4-(壬氧基)苯基酯 苯甲酸,4-丁氧基-,1,4-亚苯基酯 苯甲酸,4-[[[3-[(2,2-二甲基-1-羰基丙氧基)甲基]-3,4-二氢-2-甲基-4-羰基-6-喹唑啉基]甲基]-2-炔丙基氨基]-,五氟苯基酯 苯甲酸,4-[1-(己氧基)乙基]-,4-(辛氧基)苯基酯 苯甲酸,4-(辛氧基)-,4-[[4-[[(1-甲基庚基)氧代]羰基]苯基]乙炔基]苯基酯 苯甲酸,4-(苯基甲氧基)-,4-(癸氧基)苯基酯 苯甲酸,4-(苯基甲氧基)-,4-(壬氧基)苯基酯 苯甲酸,4-(苯基甲氧基)-,4-(十二烷氧基)苯基酯 苯甲酸,4-(癸氧基)-,4-[氰基[(1-羰基戊基)氧代]甲基]苯基酯,(R)-