bis-(4,6-dimethoxy-[1,3,5]triazin-2-yl)-amine | 33186-02-6

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 英文名称: bis-(4,6-dimethoxy-[1,3,5]triazin-2-yl)-amine
• 英文别名: 2,2'-iminobis(4,6-dimethoxy-s-triazine)；N-(4,6-dimethoxy-1,3,5-triazin-2-yl)-4,6-dimethoxy-1,3,5-triazin-2-amine
• CAS: 33186-02-6
• 化学式: C₁₀H₁₃N₇O₄
• 分子量: 295.258
• InChiKey: MGOQWJLYOMJVMT-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  21
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.4
• 拓扑面积：
  126
• 氢给体数：
  1
• 氢受体数：
  11

文献信息

• Thermoset polymers having a triazine network obtained by reaction of cyanate esters with dicyanamide room temperature ionic liquids
  申请人：Palmese Giuseppe R.

  公开号：US10544265B2

  公开（公告）日：2020-01-28

  The invention relates to the use of dicyanamide-containing ionic liquids which decrease the cure temperature of cyanate esters to form unique thermoset polymers having a triazine network. These thermoset polymers having the triazine network have an ionic character allowing for use in varied applications. The thermoset polymers described herein are useful in high temperature performance composites, and their high Tg makes them useful as a substitute for epoxies in the microelectronics industry. The thermoset polymers have good fracture toughness, excellent substrate adhesion, low shrinkage, and low moisture uptake.

  本发明涉及含双氰胺离子液体的使用，这种离子液体可降低氰酸酯的固化温度，从而形成具有三嗪网络的独特热固性聚合物。这些具有三嗪网络的热固性聚合物具有离子特性，可用于各种用途。本文所述的热固性聚合物可用于高温性能复合材料，其较高的 Tg 使其成为微电子工业中环氧树脂的替代品。热固性聚合物具有良好的断裂韧性、优异的基底粘附性、低收缩性和低吸湿性。
• THERMOSET POLYMERS HAVING A TRIAZINE NETWORK OBTAINED BY REACTION OF CYANATE ESTERS WITH DICYANAMIDE ROOM TEMPERATURE IONIC LIQUIDS
  申请人：PALMESE Giuseppe R.

  公开号：US20180044473A1

  公开（公告）日：2018-02-15

  The invention relates to the use of dicyanamide-containing ionic liquids which decrease the cure temperature of cyanate esters to form unique thermoset polymers having a triazine network. These thermoset polymers having the triazine network have an ionic character allowing for use in varied applications. The thermoset polymers described herein are useful in high temperature performance composites, and their high Tg makes them useful as a substitute for epoxies in the microelectronics industry. The thermoset polymers have good fracture toughness, excellent substrate adhesion, low shrinkage, and low moisture uptake.