PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT
申请人:Toray Industries, Inc.
公开号:EP3933906A1
公开(公告)日:2022-01-05
A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol · cm). (In general formula (1), R1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, -NR3R4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R3 and R4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or -NR3R4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R2 represents a C1-5 alkyl group. The symbol ∗ in the formula indicates bonding with a neighboring group via the ∗ moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present
根据本发明的一种光敏
树脂组合物是一种光敏
树脂组合物,它包括(a)碱溶性聚
酰亚胺,(b)含不饱和键的化合物,(c)可热交联的化合物、(d-1) 具有通式(1)所代表结构的光漂白光聚合
引发剂,和 (d-2) 具有通式(1)所代表结构的光聚合
引发剂,其在 405 纳米波长处的摩尔消光系数至少为 1000 升/(摩尔-厘米)。(在通式(1)中,R1 代表卤素原子、羟基、羧基、硝基、
氰基、-NR3R4、C1-20 单价烃基、C1-20酰基或 C1-20 烷氧基,而 R3 和 R4 各自独立地代表氢原子或 C1-10 烷基,条件是烃基中至少有一部分氢原子、烃基、酰基或烷氧基中的至少部分氢原子可被卤素原子、羟基、羧基、硝基、
氰基或 -NR3R4 取代,烃基、酰基或烷氧基中的烃基可被醚键、
硫醚键、酯键、
硫酯键、酰胺键或聚
氨酯键打断。R2 代表 C1-5 烷基。式中符号 ∗ 表示通过 ∗ 分子与邻近基团键合)。根据本发明的光敏
树脂组合物也是一种光敏
树脂组合物,它包含(a)碱溶性聚
酰亚胺,(b)含不饱和键的化合物,(c)可热交联的化合物,和(d)至少两种
肟酯类光聚合
引发剂。根据本发明的光敏
树脂组合物可以对中空结构的帽部进行高灵敏度、高质量的照相图案化。使用本发明光敏
树脂组合物的光敏
树脂片材